Masaki Omiya | Researchain

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Featured researches published by Masaki Omiya.

The Proceedings of The Computational Mechanics Conference | 2011

206 せん断荷重下における接着界面のき裂進展解析(OS2.接着・接合・界面・薄膜の理論と実験および信頼性評価(2),OS・一般セッション講演)

Masaki Omiya; Akinori Harada; Yuki Kitayama; Shoji Kamiya; Nobuyuki Shishido

The Proceedings of Mechanical Engineering Congress, Japan | 2015

J2210405 Torsion test of single crystal copper to observe dislocation motion under stress distribution

Takayuki Yokoyama; Nobuyuki Shishido; Kozo Koiwa; Shoji Kamiya; Hisashi Sato; Masaki Omiya; Tomoji Nakamura; Takashi Suzuki; Takeshi Nokuo; Toshiaki Suzuki

The Proceedings of the Materials and Mechanics Conference | 2014

OS1108 Development of evaluation method for copper crystal plasticity with small-scale specimens

Kozo Koiwa; Masaki Omiya; Chuantong Chen; Nobuyuki Shishido; Shoji Kamiya; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo

The Proceedings of Mechanical Engineering Congress, Japan | 2014

J2240407 Evaluation of mechanical energy required to separate Cu/SiN interface on different crystal orientations

Chuantong Chen; Nobuyuki Shishido; Kozo Koiwa; Shoji Kamiya; Masaki Omiya; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo

The Proceedings of Mechanical Engineering Congress, Japan | 2014

J2240406 Grain size effect on the distribution of local adhesion strength in copper interconnects structure

Nobuyuki Shishido; Hisashi Sato; Masahiro Nishida; Shoji Kamiya; Kozo Koiwa; Masaki Omiya; Tomoji Nakamura; Takashi Suzuki; Takeshi Nokuo; Toshiaki Suzuki

The Proceedings of Conference of Tokai Branch | 2014

303 Influence of local deformation at grain boundary on adhesion strength of the Cu/SiN interface in LSI interconnect

Makoto Hanai; Nobuyuki Shishido; Shoji Kamiya; Hisashi Sato; Kozo Koiwa; Masahiro Nishida; Masaki Omiya; Takashi Suzuki; Tomoji Nakamura; Takeshi Nokuo; Toshiaki Suzuki

Transactions of the Japan Society of Mechanical Engineers. A | 2013

Specimen size effect of interface strength distribution induced by grain structure of Cu line

Chuantong Chen; Nobuyuki Shishido; Kozo Koiwa; Shoji Kamiya; Hisashi Sato; Masahiro Nishida; Masaki Omiya; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo

The Proceedings of the Materials and Mechanics Conference | 2013

OS1218 Evaluation of adhesion strength at a point of Cu/ insulation layer interface in LSI by crack extension simulation with Cu crystal plasticity

Yoshinobu Ando; Kozo Koiwa; Masaki Omiya; Nobuyuki Shishido; Shoji Kamiya; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo

The Proceedings of Mechanical Engineering Congress, Japan | 2013

J211022 Anisotropy of Cu/SiN interface toughness induced by copper crystal plasticity

Chuantong Chen; Nobuyuki Shishido; Kozo Koiwa; Shoji Kamiya; Masaki Omiya; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo

The Proceedings of Mechanical Engineering Congress, Japan | 2013