Masao Mitani

Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits

A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.

CURRENT INDUCED SELF‐FIELD EFFECT IN Pb–Cu–Pb JOSEPHSON JUNCTIONS

A recovery phenomenon from the mixed to the superconducting state was observed in Pb–Cu–Pb junctions even when the tunneling current was increased over the maximum dc Josephson current. This phenomenon is well interpreted from the inclination effect of the Fraunhofer diffraction pattern because of large dc Josephson currents.