Masayuki Kitajima

A study of Wafer Level Packaging of SAW filter for module solution

In the cellular market, the demand for miniaturization becomes more severe year by year. The introduction of multiband and multimode systems has accelerated the need for further miniaturization of RF components. For SAW devices in the RF module function, low insertion loss and high attenuation performance are needed. Moreover, in the structural point, miniaturization and resistance to high molding pressure are demanded.

A 100-GHz distributed amplifier in chip-size package

We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3 dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.