Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Masakazu Takesue is active.

Publication


Featured researches published by Masakazu Takesue.


international microwave symposium | 2003

A 100-GHz distributed amplifier in chip-size package

Satoshi Masuda; Kazuhiko Kobayashi; Hidehiko Kira; Masayuki Kitajima; Masakazu Takesue; Yoshihisa Kamiya; Kazukiyo Joshin

We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3 dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.


Archive | 2000

Semiconductor device with gold bumps, and method and apparatus of producing the same

Masayuki Kitajima; Masakazu Takesue; Yoshitaka Muraoka


Archive | 1995

Lead-free solder composition with Bi, In and Sn

Masayuki Kitajima; Masakazu Takesue; Yasuo Moriya; Yoshinori Nemoto; Yumiko Fukushima


Archive | 2002

Solder alloy and soldered joint

Masayuki Kitajima; Tadaaki Shono; Masakazu Takesue; Yutaka Noda


Archive | 2003

Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy

Masakazu Takesue; Yasuo Moriya; Yoshinori Nemoto; Yumiko Fukushima


Archive | 2001

Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method

Masayuki Kitajima; Yutaka Noda; Seiichi Shimoura; Toru Okada; Masanao Fujii; Kenji Iketaki; Hidehiko Kobayashi; Masakazu Takesue; Keiichi Yamamoto; Hisao Tanaka


Archive | 2001

Soldering method and soldered joint

Masayuki Kitajima; Masakazu Takesue; Tadaaki Shono; Motoko Fujioka


Archive | 2004

Mounting substrate and mounting method of electronic part

Masakazu Takesue


Archive | 2001

Solder paste and electronic device

Masayuki Ochiai; Yasuo Yamagishi; Hiroki Uchida; Masayuki Kitajima; Masakazu Takesue; Tadaaki Shono


Archive | 2000

Method for soldering and soldered joint

Masayuki Kitajima; Masakazu Takesue; Tadaaki Shono; Motoko Fujioka

Collaboration


Dive into the Masakazu Takesue's collaboration.

Researchain Logo
Decentralizing Knowledge