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Featured researches published by Masayuki Tsutsumi.


Journal of Composite Materials | 2007

Thermal Expansion Coefficient of Unidirectional High-Strength Polyethylene Fiber Reinforced Plastics at Low Temperature

Atsuhiko Yamanaka; Toshihiro Kashima; Masayuki Tsutsumi; Kimiko Ema; Yoshinobu Izumi; Shigehiro Nishijima

High-strength polyethylene fiber (Dyneema®, DF) has a negative linear thermal expansion coefficient in the direction of the fiber. Thermal expansion coefficients of fiber-reinforced plastics are of important applications in cryogenic use. The purpose of this study is to construct the engineering technology for the thermal strain of DF reinforced plastics (DFRP) for cryogenic engineering. In this study, we investigate the thermal expansion coefficient of unidirectional high-strength DF reinforced plastics (UD-DFRP) in which DFs with different tensile moduli (15–134 GPa) and thermal expansion coefficients are used. Furthermore, using the thermal expansion coefficient and tensile modulus of each DF fiber and the matrix resin, the thermal expansion coefficients of the DFRPs are estimated by the rule of mixtures and are compared with the measured values. The results indicate that the thermal expansion coefficient of UD-DFRP behaves in a similar way to that expected from calculations based on the rule of mixtures. In addition, relationships concerning the difference between the calculated and measured values, the difference in the thermal expansion coefficient of the fiber and the resin, and the surface treatment of the fiber (adhesivity), as well as the diameter of the fiber (the area of the interfacial bonding) are studied. The results show that all of these influence the thermal expansion coefficient of UD-DFRP. The design of negative thermal expansion coefficient of UD-DFRP is established.


Archive | 2009

Laminated body, manufacturing method thereof, and laminated circuit board

Tetsuo Okuyama; Hiroyuki Wakui; Takehumi Yoshida; Masayuki Tsutsumi; Jun Okamoto; Toshiyuki Tsutiya; Satoshi Maeda


Archive | 2005

ADHESIVE SHEET, METAL-LAMINATED SHEET AND PRINTED WIRING BOARD

Satoshi Maeda; Keizo Kawahara; Masayuki Tsutsumi; Takefumi Yoshida


Archive | 2005

Thin film-laminated polyimide film and flexible printed wiring board

Satoshi Maeda; Keizo Kawahara; Masayuki Tsutsumi; Takefumi Yoshida


Archive | 2004

Polyimide film and copper-clad laminate film using the same

Keizo Kawahara; Satoshi Maeda; Kazutake Okamoto; Masayuki Tsutsumi; 郷司 前田; 正幸 堤; 和丈 岡本; 恵造 河原


Archive | 2009

Peelable polyimide film laminate

Keizo Kawahara; Masayuki Tsutsumi; Takeshi Yoshida; 武史 吉田; 正幸 堤; 恵造 河原


Archive | 2010

Method for manufacturing cushion layer for polishing pad

Shigeru Komai; Masahiko Nakamori; Koichi Ono; Tetsuo Shimomura; Masayuki Tsutsumi; Takatoshi Yamada; 哲生 下村; 雅彦 中森; 正幸 堤; 浩一 小野; 孝敏 山田; 茂 駒井


Journal of Applied Polymer Science | 2006

Radiation effect on the thermal conductivity and diffusivity of ramie fibers in a range of low temperatures by γ rays

Atsuhiko Yamanaka; Yoshinobu Izumi; Takaya Terada; Kimiko Ema; Masayuki Tsutsumi; Muneatsu Nakamura; Takeshi Oohazama; Tooru Kitagawa; Hiroyuki Fujishiro; Shunzo Abe; Shigehiro Nishijima


Journal of Polymer Science Part B | 2005

Effects of vapor-phase-formaldehyde treatments on thermal conductivity and diffusivity of ramie fibers in the range of low temperature

Atsuhiko Yamanaka; Masatoshi Yoshikawa; Shunzo Abe; Masayuki Tsutsumi; Takeshi Oohazama; Tooru Kitagawa; Hiroyuki Fujishiro; Kimiko Ema; Yoshinobu Izumi; Shigehiro Nishijima


Journal of Applied Polymer Science | 2006

Thermal conductivity of ramie fiber drawn in water in low temperature

Atsuhiko Yamanaka; Shunzo Abe; Masayuki Tsutsumi; Tooru Kitagawa; Hiroyuki Fujishiro; Kimiko Ema; Yoshinobu Izumi; Shigehiro Nishijima

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