Matthew Kaufmann | Researchain

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Publication

Featured researches published by Matthew Kaufmann.

Archive | 2008

Embedded package security tamper mesh

Mark Buer; Matthew Kaufmann

Archive | 2005

Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer

Matthew Kaufmann; Ray Huang; Vincent Chen

Archive | 2011

Integrated Circuit Package Security Fence

Matthew Kaufmann; Mark Buer; Reza Sharifi

Archive | 2007

Highly Reliable Low Cost Structure for Wafer-Level Ball Grid Array Packaging

Matthew Kaufmann; Teck Yang Tan

Archive | 2009

Package-on-package technology for fan-out wafer-level packaging

Matthew Kaufmann; Teck Yang Tan

Archive | 2007

LARGER THAN DIE SIZE WAFER-LEVEL REDISTRIBUTION PACKAGING PROCESS

Matthew Kaufmann

Archive | 2007

Low cost lead frame package and method for forming same

Ken Jian Ming Wang; Matthew Kaufmann

Archive | 2014

Low cost and high performance flip chip package

Mengzhi Pang; Ken Zhonghua Wu; Matthew Kaufmann

Archive | 2011

Enhanced bump pitch scaling

Mengzhi Pang; Matthew Kaufmann

Archive | 2009

WAFER-LEVEL REDISTRIBUTION PACKAGING WITH DIE-CONTAINING OPENINGS

Matthew Kaufmann; Teck Yang Tan

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Collaboration

Dive into the Matthew Kaufmann's collaboration.

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Teck Yang Tan

Broadcom

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Mark Buer

Broadcom

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Mengzhi Pang

Broadcom

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Arya Reza Behzad

Broadcom

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Henry K. Chen

Broadcom

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Jacob Rael

Broadcom

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Ken Jian Ming Wang

Broadcom

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Ken Zhonghua Wu

Broadcom

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Malcolm MacIntosh

Broadcom

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Morteza Cyrus Afghahi

Broadcom

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