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Dive into the research topics where Maurice Francis Holahan is active.

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Featured researches published by Maurice Francis Holahan.


2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 | 2003

THE THERMAL RESISTANCE OF PIN FIN HEAT SINKS IN TRANSVERSE FLOW

Sukhvinder Kang; Maurice Francis Holahan

This paper presents a physics based analytical model to predict the thermal behavior of pin fin heat sinks in transverse forced flow. The key feature of the model is the recognition that unlike plate fins, streamwise conduction does not occur in pin fin heat sinks. Thus, the heat transfer from each fin depends on its local air temperature or adiabatic temperature and the local adiabatic heat transfer coefficient. Both experimental data and simplified CFD simulations are used to develop the two building blocks of the model, the thermal wake function and the adiabatic heat transfer coefficient. These building blocks are then used to include the effect of the thermal wake from upstream fins on the adiabatic temperature of downstream fins in determining the fin-by-fin heat transfer within the pin fin array. This approach captures the essential physics of the flow and heat transport within the fin array and yields an accurate model for predicting the thermal resistance of pin fin heat sinks. Model predictions are compared with existing experimental data and CFD simulations. The model is expected to provide a sound basis for a consistent performance comparison with plate fin heat sinks.


ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference | 2007

Fan Laws for Rack Systems

Maurice Francis Holahan; Bret P. Elison

As datacenter aisle noise levels approach OSHA workplace limits, air-cooled server racks share with desktop workstations the ultimate problem of being thermally constrained within a finite packaging volume by acoustic emission restrictions. The primary source of noise in most scalable 1 and 2 EIA rack drawers is an air moving device. Multiple compact dual stage counter-rotating bladed tubeaxial devices are being adopted to overcome the pressure drop of increasingly densely packed electronics. The design problem of maximizing hydraulic output within space and noise constraints naturally leads to the question of whether these many smaller fans could be gainfully replaced by fewer but larger fans. To examine this question, the fan laws for single devices are extended to equivalent systems of multiple parallel and series fans. The principle of impedance matching is applied to hydraulic sources and loads to maximize pumping power. A novel method is introduced to map fan speed, size, and hydraulic performance. The paper provides a proof that equal-staged noise-neutral space-filling planar arrays of parallel homologous devices must deliver the same net rack flow and pressure, and it shows that series arrangements of multiple stages of planar parallel fan arrays will always, under acoustic parity conditions, yield increased pressure at diminishing flow with each successive stage. At equivalent system hydraulic output, larger fans in series are shown to consume greater packaging volume while achieving lower overall acoustic output. Net rack flow and pressure relationships are also quantified for systems of equal total rack fan shaft power input. Examination of actual unit level fan noise measurements suggests that in practice, systems of small fans typically output 4 to 9 dB higher noise levels than larger fans operated at the same net flow and pressure. Finally, a survey of unit level airflow and power input measurements reveals that larger fans exhibit higher total efficiency than smaller fans.Copyright


Archive | 1989

Apparatus for cooling electronics components

William Dale Corfits; Maurice Francis Holahan; Susan Jean Martino; David Roy Motschman; James Robert Thorpe


Archive | 2009

HIGH PERFORMANCE DUAL-IN-LINE MEMORY (DIMM) ARRAY LIQUID COOLING ASSEMBLY AND METHOD

Levi A. Cambell; Richard C. Chu; Michael J. Ellsworth; Maurice Francis Holahan; Madhusudan K. Iyengar; Robert E. Simons; Rebecca N. Wagner


Archive | 2008

Enhancing the Cooling of Dual In-Line Memory Modules

Eric A. Eckberg; Maurice Francis Holahan


Archive | 2008

Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same

Matthew Allen Butterbaugh; Maurice Francis Holahan; Terry L. Lyon; David Roy Motschman


Archive | 2004

Device for preventing backflow in a cooling system

Jessica Rose Berens; Cary Michael Huettner; Michael S. Good; Maurice Francis Holahan


Archive | 2009

Heat Sink Apparatus with Extendable Pin Fins

Don A. Gilliland; Maurice Francis Holahan; Cary Michael Huettner


Archive | 2006

Non-Influencing Fastener for Mounting a Heat Sink in Contact with an Electronic Component

John L. Colbert; John S. Corbin; Eric A. Eckberg; James D. Gerken; Roger Duane Hamilton; Maurice Francis Holahan


Archive | 2003

Method and apparatus for protecting electronic devices against particulate infiltration, excessive heat build-up, and for implementing EMC shielding

Louis Edward Behrens; Matthew Allen Butterbaugh; Don A. Gilliland; Maurice Francis Holahan; Paul Daniel Pederson

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