Mehrdad M. Moslehi

Ultra high-speed chip semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectrics

Microelectronic interconnect material with adhesion promotion layer and fabrication method

Method for forming a copper film on a substrate

Semiconductor chip interconnect barrier material and fabrication method

Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing

Apparatus for supporting a substrate in a reaction chamber

Method of chemical-vapor deposition of a material

Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure

Shutter for thin-film processing equipment

Thermally conductive chuck for vacuum processor