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Mei-Ling Chen

United Microelectronics Corporation

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Publication

Featured researches published by Mei-Ling Chen.

Archive | 2005

DUAL DAMASCENE PROCESS UTILIZING TEOS-BASED SILICON OXIDE CAP LAYER HAVING REDUCED CARBON CONTENT

Jei-Ming Chen; Miao-Chun Lin; Kuo-Chih Lai; Mei-Ling Chen; Cheng-Ming Weng; Chun-jen Huang; Yu-Tsung Lai

Archive | 2005

Method of restoring low-k material or porous low-k layer

Mei-Ling Chen; Jei-Ming Chen; Kuo-Chih Lai; Wen-Chieh Su

Archive | 2006

Copper damascene process

Kuo-Chih Lai; Mei-Ling Chen; Jei-Ming Chen; Hsin-Hsing Chen; Shih-Feng Su; Meng-Chi Chen

Archive | 2006

Porous low-k dielectric film and fabrication method thereof

Mei-Ling Chen; Su-Jen Sung; Kuo-Chih Lai; Jei-Ming Chen

Archive | 2008

METHOD OF CURING POROUS LOW-K LAYER

Mei-Ling Chen; Kuo-Chih Lai; Su-Jen Sung

Archive | 2007

ULTRA LOW DIELECTRIC CONSTANT (K) DIELECTRIC LAYER AND METHOD OF FABRICATING THE SAME

Mei-Ling Chen; Su-Jen Sung; Chien-Chung Huang

Archive | 2006

METHOD OF IMPROVING ADHESION PROPERTY OF DIELECTRIC LAYER AND INTERCONNECT PROCESS

Kuo-Chih Lai; Mei-Ling Chen; Jei-Ming Chen

Archive | 2007

FORMING METHOD AND STRUCTURE OF POROUS LOW-K LAYER, INTERCONNECT PROCESS AND INTERCONNECT STRUCTURE

Mei-Ling Chen; Kuo-Chih Lai; Su-Jen Sung; Chien-Chung Huang; Yu-Tsung Lai

Archive | 2011

Structure of porous low-k layer and interconnect structure

Mei-Ling Chen; Kuo-Chih Lai; Su-Jen Sung; Chien-Chung Huang; Yu-Tsung Lai

Archive | 2009

FABRICATION METHOD OF POROUS LOW-K DIELECTRIC FILM

Mei-Ling Chen; Su-Jen Sung; Kuo-Chih Lai; Jei-Ming Chen

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Kuo-Chih Lai

United Microelectronics Corporation

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Su-Jen Sung

United Microelectronics Corporation

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Jei-Ming Chen

United Microelectronics Corporation

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Chien-Chung Huang

United Microelectronics Corporation

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Yu-Tsung Lai

United Microelectronics Corporation

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Cheng-Ming Weng

United Microelectronics Corporation

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Chun-jen Huang

United Microelectronics Corporation

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Miao-Chun Lin

United Microelectronics Corporation

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