Mei-Ling Chen

DUAL DAMASCENE PROCESS UTILIZING TEOS-BASED SILICON OXIDE CAP LAYER HAVING REDUCED CARBON CONTENT

Method of restoring low-k material or porous low-k layer

Copper damascene process

Porous low-k dielectric film and fabrication method thereof

METHOD OF CURING POROUS LOW-K LAYER

ULTRA LOW DIELECTRIC CONSTANT (K) DIELECTRIC LAYER AND METHOD OF FABRICATING THE SAME

METHOD OF IMPROVING ADHESION PROPERTY OF DIELECTRIC LAYER AND INTERCONNECT PROCESS

FORMING METHOD AND STRUCTURE OF POROUS LOW-K LAYER, INTERCONNECT PROCESS AND INTERCONNECT STRUCTURE

Structure of porous low-k layer and interconnect structure

FABRICATION METHOD OF POROUS LOW-K DIELECTRIC FILM