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Dive into the research topics where Michael E. Barsky is active.

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Featured researches published by Michael E. Barsky.


IEEE Transactions on Microwave Theory and Techniques | 2003

Cryogenic wide-band ultra-low-noise IF amplifiers operating at ultra-low DC power

Niklas Wadefalk; Anders Mellberg; Iltcho Angelov; Michael E. Barsky; Stacey Bui; Emmanuil Choumas; R. Grundbacher; Erik L. Kollberg; R. Lai; Niklas Rorsman; Piotr Starski; Jörgen Stenarson; D.C. Streit; Herbert Zirath

This paper describes cryogenic broad-band amplifiers with very low power consumption and very low noise for the 4-8-GHz frequency range. At room temperature, the two-stage InP-based amplifier has a gain of 27 dB and a noise temperature of 31 K with a power consumption of 14.4 mW per stage, including bias circuitry. When cooled to 15 K, an input noise temperature of 1.4 K is obtained at 5.7 mW per stage. At 0.51 mW per stage, the input noise increases to 2.4 K. The noise measurements have been repeated at different laboratories using different methods and are found consistent.


IEEE Transactions on Microwave Theory and Techniques | 2003

AlGaN/GaN HEMTs - operation in the K-band and above

Ioulia Smorchkova; Mike Wojtowicz; Rajinder Sandhu; Roger Tsai; Michael E. Barsky; Carol Namba; P.-S. Liu; R. Dia; Minhdao Truong; D. Ko; J. Wang; H. Wang; A. Khan

Reports on the power and microwave noise performance of AlGaN/GaN high electron-mobility transistors (HEMTs) at frequencies f>18 GHz (K- and Ka-bands). At 20 GHz, a record continuous-wave output power of 1.6 W has been achieved on an eight-finger 500-/spl mu/m total gate-periphery device. At 29 GHz, a 120-/spl mu/m gate-periphery device showed a pulsed output density of 1.6 W/mm with an associated gain of 6.7 dB and power-added efficiency of 26%. Minimum noise figure of 1.5 dB has been achieved on a 0.2 /spl mu/m /spl times/ 200 /spl mu/m device at 26 GHz. The data demonstrate the viability of AlGaN/GaN HEMTs for high-frequency power and low-noise amplifier applications.


international microwave symposium | 2017

Sub-20-K noise temperature LNA for 67–90 GHz frequency band

Pekka Kangaslahti; Kieran Cleary; Jacob W. Kooi; Lorene Samoska; Richard Lai; Michael E. Barsky; Xiaobing Mei; Stephen Sarkozy; Mikko Varonen

Indium Phosphide MMIC LNAs are enabling new capabilities in instrument development. The development of arrays of hundreds of cryogenically-cooled millimeter wave receivers has previously been challenging, but is now achievable with highly repeatable MMIC processes and advances in cryogenic on-wafer testing of LNAs. We have developed InP HEMT LNA MMICs for the 67–90 GHz frequency band that is the last missing receiver system from the ALMA. These MMICs provided average performance of less than 22.5 K noise temperature over the frequency band and minimum noise temperature of 17.5 K at 72 GHz. These LNAs achieve NT=220K (NF=2.4dB) at 90 GHz for Earth remote sensing instrument on Sentinel-6. Our HRMR (High Resolution Microwave Radiometer) achieves NEDT < 0.05K enabling Sentinel-6 to measure coastal ocean topography at 3 km resolution with better than 1 cm accuracy.


Japanese Journal of Applied Physics | 2002

Enhancement-Mode InGaAs/InAlAs/InP High Electon Mobility Transistor with 0.1 µm Gate

R. Grundbacher; Richard Lai; Michael E. Barsky; Roger Tsai; Rosalinda M. Dia; Yeong-Chang Chou; L.T. Tran; Abdullah Cavus; Thomas R. Block; Aaron Oki

We present state-of-the-art performance of 0.1 µm gate enhancement-mode (E-mode) InGaAs/InAlAs/InP high electron mobility transistors (HEMTs) fabricated on 3-inch wafers in a production environment. The E-mode HEMTs have transconductance of 1180 mS/mm, cutoff frequency of 210 GHz, and less than 1 mA/mm Idss (drain current at a gate bias of zero volts), measured at a drain bias of 1 V. The device characteristics make the E-mode HEMTs suitable candidates for ultra-high-speed analog and digital applications. Enhancement-mode HEMT devices and low noise amplifiers utilizing E-mode HEMTs, which were fabricated on 3-inch wafers in TRWs InP production line, demonstrated excellent repeatability, performance, yield, and uniformity.


Archive | 2000

Partially relaxed channel HEMT device

Michael Wojtowicz; Tsung-Pei Chin; Michael E. Barsky; R. Grundbacher


Archive | 2003

Hard substrate wafer sawing process

Michael E. Barsky; Michael Wojtowicz; Rajinder Sandhu


Archive | 2009

High electron mobility transistor semiconductor device and fabrication method thereof

Linh Dang; W. Yoshida; Xiaobing Mei; Jennifer Wang; P.H. Liu; J. Lee; Weidong Liu; Michael E. Barsky; Richard Lai


Archive | 2000

Wafer adhesive for semiconductor dry etch applications

Michael E. Barsky; Harvey N. Rogers; Vladimir Medvedev; Y.C. Chen; R. Lai


Archive | 2000

ENHANCEMENT-MODE DEVICE

R. Lai; R. Grundbacher; Y.C. Chen; Michael E. Barsky


Archive | 2008

Leakage barrier for GaN based HEMT active device

Rajinder Sandhu; Michael E. Barsky; Michael Wojtowicz

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Roger Tsai

California Institute of Technology

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