Michael J. Haji-Sheikh
Honeywell
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Featured researches published by Michael J. Haji-Sheikh.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1997
Michael J. Haji-Sheikh; David W. Ulz; Michael Campbell
The MICRO SWITCH Division of Honeywell adopted the IBM C4 flip chip die attach method for its underhood automotive applications in the mid to late 1970s. There has been a gradual increase in the reliability of IC-ceramic solder joints. This experiment shows the effect of the interface metallurgy on the thermal-cycle fatigue life of C4 technology. Samples are manufactured using a standard industry technique first pioneered by IBM. Included are results from initial experimentation on post processed bump limiting metallurgy (BLM), and mechanical data on two different sizes of IC with the variation of gold thickness. Assemblies were exposed to a thermal-cycle temperature range of -40/spl deg/C to 150/spl deg/C. In the initial tests, half of each wafer is placed in 1/1 concentrated H/sub 2/O/sub 2//Acetic to remove the PbSn bump and expose the BLM. The etched samples are SEM/EDS analyzed for interfacial constituents. A comparison of the interface morphologies and the thermal-cycle fatigue life are shown. These results show that for extended thermal-cycle life times (>1000) that the Cu thickness of 1.2 /spl mu/m and an Au thickness of 0.08 /spl mu/m which is reduced from the initial 0.15 /spl mu/m of our standard process is optimal. This is due to the reduced Au incorporation in the copper-tin intermetallic which produces an increase in the fatigue life and strength of the joints.
Archive | 2001
Mark R. Plagens; Michael J. Haji-Sheikh; Walter T. Matzen
Archive | 1995
Michael J. Haji-Sheikh
Archive | 2003
Michael J. Haji-Sheikh; Gilberto Morales
Archive | 2001
Michael J. Haji-Sheikh; Mark R. Plagens; Robert Kryzanowski
Archive | 2001
Aravind Padmanabhan; Ulrich Bonne; Michael J. Haji-Sheikh
Archive | 2001
Michael J. Haji-Sheikh; Richard A. Davis; Mark R. Plagens; Carl Stewart; Gilberto Morales
Archive | 2003
Aravind Padmanabhan; Ulrich Bonne; Michael J. Haji-Sheikh
Archive | 2002
Michael J. Haji-Sheikh; Ronald W. Chandler
Archive | 2001
Michael J. Haji-Sheikh; Gilberto Morales