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Michio Sono

Fujitsu

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Publication

Featured researches published by Michio Sono.

Archive | 1997

Semiconductor device and semiconductor device unit for a stack arrangement

Tetsuya Fujisawa; Mitsutaka Sato; Junichi Kasai; Masataka Mizukoshi; Kosuke Otokita; Hiroshi Yoshimura; Katsuhiro Hayashida; Akira Takashima; Masahiko Ishiguri; Michio Sono

Archive | 1995

Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device

Masayuki Ochiai; Hidefumi Ueda; Michio Sono; Ichiro Yamaguchi; Kazuhiko Mitobe; Koki Otake; Junichi Kasai; Nobuo Kamehara; Yasuo Yamagishi; Masataka Mizukoshi; Yutaka Yamada; Susumu Abe

Archive | 1997

Semiconductor device and method of forming the device

Michio Sono; Masashi Takenaka; Masanori Yoshimoto; Tsuyoshi Aoki; Ichiro Yamaguchi; Koki Otake

Archive | 1994

Semiconductor device with surface mount package adapted for vertical mounting

Norio Taniguchi; Kazuto Tsuji; Junichi Kasai; Michio Sono

Archive | 1996

Semiconductor device and semiconductor device unit

Norio Taniguchi; Junichi Kasai; Kazuto Tsuji; Michio Sono; Masanori Yoshimoto; Katsuhiro Hayashida; Mitsutaka Sato; Hiroshi Yoshimura; Tadashi Uno; Kosuke Otokita; Tetsuya Fujisawa

Archive | 1995

Method for fabricating solder bumps by forming solder balls with a solder ball forming member

Masayuki Ochiai; Hidefumi Ueda; Michio Sono; Ichiro Yamaguchi; Kazuhiko Mitobe; Koki Otake; Junichi Kasai; Nobuo Kamehara; Yasuo Yamagishi; Masataka Mizukoshi

Archive | 1997

Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package

Tetsuya Fujisawa; Mitsutaka Sato; Junichi Kasai; Masataka Mizukoshi; Kousuke Otokita; Hiroshi Yoshimura; Katsuhiro Hayashida; Akira Takashima; Masahiko Ishiguri; Michio Sono

Archive | 1994

Semiconductor device having improved leads comprising palladium plated nickel

Kazuto Tsuji; Yoshiyuki Yoneda; Junichi Kasai; Michio Sono

Archive | 1995

Process for manufacturing a packaged semiconductor having a divided leadframe stage

Kazuto Tsuji; Yoshiyuki Yoneda; Hideharu Sakoda; Michio Sono; Ichiro Yamaguchi; Toshio Hamano; Yoshihiro Kubota; Michio Hayakawa; Yoshihiko Ikemoto; Yukio Saigo; Naomi Miyaji

Archive | 1996

Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device

Michio Sono; Kazuto Tsuji; Hideharu Sakoda; Yoshimi Suzuki; Masao Sakuma

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Collaboration

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Junichi Kasai

Fujitsu

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Masanori Yoshimoto

Fujitsu

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Kazuto Tsuji

Fujitsu

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Norio Taniguchi

Fujitsu

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Kouji Saito

Fujitsu

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Ichiro Yamaguchi

Fujitsu

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Kazuhiko Mitobe

Fujitsu

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Hiroaki Hayashi

Fujitsu

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Koki Otake

Fujitsu

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Toshimi Kawahara

Fujitsu

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