Mihai Gologanu
Honeywell
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Publication
Featured researches published by Mihai Gologanu.
international semiconductor conference | 2012
Mihai Gologanu; Cazimir G. Bostan; Viorel Avramescu; Octavian Buiu
Damping effects are very important in MEMS-based sensors and actuators. In this paper we use analytical models and finite element (FE) computations to quantify the energy losses due to viscous fluid damping, acoustic radiation and thermo-elastic damping. To treat the case where squeeze/slide film models can not be applied, we have implemented in a commercial FE package a new incompressible flow solver based on a gauge formulation. We are thus able to solve for full flows around complex 3D geometries in the frequency domain and predict viscous damping of resonant MEMS structures. The full methodology is exemplified on the response of a MEMS silicon resonator, including acoustic driving and piezoelectric sensing.
international semiconductor conference | 2012
Mihai Brezeanu; Viorel-Georgel Dumitru; Stefan Dan Costea; Syed Zeeshan Ali; Florin Udrea; Mihai Gologanu; Cazimir G. Bostan; Ion Georgescu; Viorel Avramescu; Octavian Buiu
This paper introduces a pressure sensing structure configured as a stress sensitive differential amplifier (SSDA), built on a Silicon-on-Insulator (SOI) membrane. Theoretical calculation show the significant increase in sensitivity which is expected from the pressure sensors in SSDA configuration compared to the traditional Wheatstone bridge circuit. Preliminary experimental measurements, performed on individual transistors placed on the membrane, exhibit state-the-art sensitivity values (1.45mV/mbar).
international semiconductor conference | 2017
Titus Sandu; George Boldeiu; Rodica Voicu; Mihai Gologanu
We report a general setting in which the thermal conductivity of nanocomposites can be calculated. Interfacial thermal resistance is also considered and no shape assumptions are made. By this method we have found that oblate spheroidal approximation of graphene nanodots in graphene-based nanocomposites is not adequate to model thermal conductivity of these composites.
international semiconductor conference | 2017
Viorel Avramescu; Mihai Gologanu
This paper presents a potentially cheap oxygen sensor based on photo acoustic (PA) principle. Commercially available low cost devices are used for this implementation. The presentation is focused on aspects related to PA signal analysis, PA chamber influence on sensor response and environmental humidity impact on sensor sensitivity.
Archive | 2005
Cornel Cobianu; Mihai Gologanu; Ioan Pavelescu; Bogdan Catalin Serban
Archive | 2010
Keith Francis Edwin Pratt; John Chapples; Martin Geoffrey Jones; Stefan Dan Costea; Mihai Gologanu
Archive | 2008
Mihai Gologanu; Viorel Avramescu; Stefan Dan Costea; Li Wang
Archive | 2006
Cornel Cobianu; Bogdan Catalin Serban; Ioan Pavelescu; Mihai Gologanu
Archive | 2012
Viorel Avramescu; Mihai Gologanu; Daniel W. Youngner; Bob Jon Carlson
Archive | 2007
Cornel Cobianu; Viorel-Georgel Dumitru; Ion Georgescu; Mihai Gologanu; Stefan Dan Costea