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Minill Kim

Samsung

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Publication

Featured researches published by Minill Kim.

Archive | 2006

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Minill Kim; Dong-Kuk Kim; Chang-Cheol Lee; Tae-Hoe Hwang; Jae-young Hong

Archive | 2009

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Jong-gi Lee; Sun-Won Kang; Young Lyong Kim; Jong-ho Lee; Chul-Yong Jang; Minill Kim; Eun-Chul Ahn; Kwang Yong Lee; Seung-Duk Baek; Ji-Seok Hong

Archive | 2009

COIL AND SEMICONDUCTOR APPARATUS HAVING THE SAME

Minill Kim; Kwang Yong Lee; Jong-gi Lee; Ji-Seok Hong; Hyun Jeong Woo

Archive | 2009

CIRCUIT MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR CIRCUIT

Minill Kim; Tae-Gyeong Chung; Jong-gi Lee; Kwang Yong Lee

Archive | 2011

INSERT MEMBER, APPARATUS FOR BLANKING PRINTED CIRCUIT FILM HAVING THE SAME AND METHOD OF BLANKING PRINTED CIRCUIT FILM USING THE APPARATUS

Minill Kim; Seungyu Myung; Tackkeun Lee; Nakhwan Seong; Shin Kim

Archive | 2008

In-line package apparatuses and methods

Minill Kim; Jong-gi Lee; Kwang-Yong Lee; Ki-Kwon Jeong

Archive | 2005

Device and method for manufacturing wafer-level package

Suk-Kun Lim; Chae-Hun Im; Minill Kim; Chang-Cheol Lee

Archive | 2010

METHOD OF INTERCONNECTING CHIPS USING CAPILLARY MOTION

Kwang-Yong Lee; Jong-gi Lee; Minill Kim; Min-Seung Yoon; Ji-Seok Hong

Archive | 2009

Reflow apparatus, Reflow method, and package apparatus

Minill Kim; Kwang Yong Lee; Jong-gi Lee; Ji-Seok Hong

Archive | 2009

Circuit manufacturing apparatus

Minill Kim; Tae-Gyeong Chung; Jong-gi Lee; Kwang Yong Lee

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Collaboration

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Jong-gi Lee

Samsung

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Kwang Yong Lee

Samsung

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Ji-Seok Hong

Samsung

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Tackkeun Lee

Samsung

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Chang-Cheol Lee

Samsung

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Jihoon Mok

Samsung

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Ki-Kwon Jeong

Samsung

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Kwang-Yong Lee

Samsung

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Sangmyung Byun

Samsung

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Tae-Gyeong Chung

Samsung

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