Mitsunori Abe
Fujitsu
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Publication
Featured researches published by Mitsunori Abe.
Microelectronics Reliability | 2002
Kinuko Mishiro; Shigeo Ishikawa; Mitsunori Abe; Toshio Kumai; Yutaka Higashiguchi; Kenichiro Tsubone
Abstract In this study, ball grid arrays (BGAs) and chip size packages (CSPs) were evaluated with respect to their solder joint reliabilities under drop impacts. The correlation between solder joint stresses and motherboard strains was confirmed by numerical analysis, and the motherboard strains caused by the drop impacts were measured to evaluate the BGA/CSP reliability. The authors found that the stress at a solder joint differs depending on the package structure, even if the motherboard strain is the same, and that underfilling eases the motherboard strain and disperses the stress concentrated on a solder joint.
Archive | 1997
Hidehiro Mishiro; Kenichiro Tsubone; Mitsunori Abe; Rie Takada
Archive | 2010
Mitsunori Abe; Takashi Fukuda
Archive | 2002
Hidehiko Nakata; Mitsunori Abe; Tadao Inoue
Archive | 1994
Hidehiro Mishiro; Kenichiro Tsubone; Mitsunori Abe; Rie Takada
Archive | 2008
Yoshikazu Hirano; Mitsunori Abe
Archive | 2008
Yoshikazu Hirano; Mitsunori Abe
Archive | 2017
Shigeo Iriguchi; Naoki Nakamura; Mitsunori Abe; Nobuo Taketomi; Kiyoyuki Hatanaka; Ryo Kanai
Archive | 2016
Mitsunori Abe; Kiyoyuki Hatanaka; Nobuo Taketomi; Shigeo Iriguchi; Ryo Kanai; Naoki Nakamura
Archive | 2014
Yoshikazu Hirano; Mitsunori Abe; Takashi Fukuda
