Kenichiro Tsubone
Fujitsu
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Publication
Featured researches published by Kenichiro Tsubone.
Microelectronics Reliability | 2002
Kinuko Mishiro; Shigeo Ishikawa; Mitsunori Abe; Toshio Kumai; Yutaka Higashiguchi; Kenichiro Tsubone
Abstract In this study, ball grid arrays (BGAs) and chip size packages (CSPs) were evaluated with respect to their solder joint reliabilities under drop impacts. The correlation between solder joint stresses and motherboard strains was confirmed by numerical analysis, and the motherboard strains caused by the drop impacts were measured to evaluate the BGA/CSP reliability. The authors found that the stress at a solder joint differs depending on the package structure, even if the motherboard strain is the same, and that underfilling eases the motherboard strain and disperses the stress concentrated on a solder joint.
Archive | 1997
Hidehiro Mishiro; Kenichiro Tsubone; Mitsunori Abe; Rie Takada
Fujitsu Scientific & Technical Journal | 2007
Tsuyoshi Yamamoto; Kenichiro Tsubone
Archive | 2005
Kinuko Mishiro; Kenichiro Tsubone
Archive | 2005
Kinuko Mishiro; Kenichiro Tsubone; 絹子 三代; 健一郎 坪根
Archive | 2009
Rie Takada; Kenichiro Tsubone
Archive | 2006
Yasuhide Kuroda; Kenichiro Tsubone
Archive | 2002
Jiyoushi Goto; Toshio Kumai; Tatsuya Okuno; Kenichiro Tsubone; 健一郎 坪根; 辰弥 奥野; 錠志 後藤; 利夫 熊井
Archive | 2005
Rie Takada; Kenichiro Tsubone
Archive | 1994
Hidehiro Mishiro; Kenichiro Tsubone; Mitsunori Abe; Rie Takada
