Mohammed Ilyas

Microelectronic elements with post-ssembly planarization

Microelectronic package structure and method for manufacturing same

Stacking of wafer-level chip scale packages having edge contacts and manufacture method thereof

unidade de microeletrônica, conjunto microeletrônica, métodos de fabricação de uma microeletrônicas, e, sistemas.

A microelectornic unit nad method of fabricating thereof

System and microelectronic assembly of multiple die face-down stacking for two or more die

High density three-dimensional integrated capacitors and methods of fabrication thereof

Method of fabricating a component for electrical interconnection

Microelectronic assembly and method of fabricating a stacked microelectronic assembly

Improved quantum efficiency of multiple quantum wells