Mohd Arif Anuar Mohd Salleh

Strength of Concrete Based Cement Using Recycle Ceramic Waste as Aggregate

The main focus of this research is to study the strength of concrete with ceramic waste as coarse aggregate. The sources of ceramic waste are obtained from the industrial in Malaysia. Presently, in ceramics industries the production goes as waste, which is not under going the recycle process yet. The potential of recycled ceramic waste as a substitute for coarse aggregates in concrete has been investigated. The recycle ceramic waste as aggregate was used. Concrete mixes with a 28 days characteristic strength of 20 MPa were prepared using water/cement ratio of 0.4, 0.5 and 0.7. The strength development of the concrete mixes containing recycled ceramic waste aggregates was compared to that of conventional concrete. The result show that the concrete mixes containing recycled ceramic waste aggregates achieve strength levels between 80 to 95 % compared to the conventional concrete. This indicates that the recycled ceramic waste has a potentially to be used as coarse aggregates for concrete.

Zn-Sn Based High Temperature Solder - A Short Review

The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.

Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder

Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper focuses on the intermetallic compound (IMC) formation study between the fabricated solder composite on Cu-substrate. Throughout this study, four different composition of Sn-0.7Cu/re-Al (0.0, 3.0, 3.5, 4.0 wt.%) were studied. X-ray diffraction (XRD) was used to analyze the IMCs phase formation between the interfaces. New IMC phase of Cu9Al4 was detected beside Cu6Sn5 and Cu3Sn in the composite solder samples. However, Sn-0.7Cu/3.0re-Al showed least formation of brittle IMCs compared to the monolithic solder.

Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder

A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride particulates were introduced as reinforcements to obtain a novel lead-free nanocomposite solder alloy. Following fabrication, the sintered nanocomposite solder were cut into thin solder disc and were analyzed in terms of their wettability, electrical and mechanical properties. Wettability, electrical and mechanical properties of the nanocomposite solder were compared to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder which were fabricated with the same method using powder metallurgy route. Wettability property of the nanocomposite solder was found to be in the accepted range with wettability angle below 45° similar to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder. Besides wettability, the results of electrical and mechanical properties analysis showed that additions of nano size Si3N4 had enhanced the strength and electrical conductivity of nanocomposite solder comparing to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder.

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

The effect of micron-size silicon nitride (Si3N4) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si3N4 (0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Study on the Properties of Oil Palm Trunk Fiber (OPTF) in Cement Composite

Properties of oil palm trunk fiber reinforced cement composite were investigated in this study. Oil palm trunk fiber was used to improve the properties of cement composite. It was found that increasing in oil palm trunk fiber content up to certain percentage increase the compressive strength and decrease the density of cement composite. Besides, the study also found that additional of excessive of oil palm trunk fiber in cement composite decrease the compressive strength and continues to increase the water absorption and moisture content hence decrease the density. From this study, it was found that 2 wt. % of fiber content was the optimum fiber content to give the highest compressive strength of 38.61 MPa.

Microstructure Studies on Different Types of Geopolymer Materials

Geopolymer is a new binding material produced to substitute the ordinary Portland cement (OPC) function as a binder in concrete. As we know, different types of geopolymer will have different properties. In this research, the different types of geopolymer raw materials had been studied in term of microstructure. Different type of materials which is fly ash (class F) and kaolin had been mixed with alkaline solution consist of sodium silicate and sodium hydroxide with suitable geopolymer raw material to alkaline activator and sodium silicate to sodium hydroxide ratios. The geopolymer samples with different types of raw material were then cured at a temperature 70°C for 24 hr and maintained at room temperature until the testing was conducted. After the geopolymers were aged for seven days, the testing was conducted.

Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method

The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported.

Microstructural and phase analysis of Sn-Cu-Ni-XSiC composite solder

The effect of ceramic addition on the Sn-Cu-Ni solder alloy microstructure has been investigated. Sn-Cu-Ni/SiC composite solder samples were fabricated via powder metallurgy (PM) techniques. In this study, five different SiC composition were chosen (0 wt. %, .25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). The results revealed that a small amount of SiC addition has well distributed along the grain boundaries which also refines the β-Sn phase.The effect of ceramic addition on the Sn-Cu-Ni solder alloy microstructure has been investigated. Sn-Cu-Ni/SiC composite solder samples were fabricated via powder metallurgy (PM) techniques. In this study, five different SiC composition were chosen (0 wt. %, .25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). The results revealed that a small amount of SiC addition has well distributed along the grain boundaries which also refines the β-Sn phase.