Mohd Izrul Izwan Ramli

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

The effect of micron-size silicon nitride (Si3N4) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si3N4 (0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

This research has investigated the physical performances of low-silver Sn-Ag-Cu (SAC) lead-free composite solder reinforced with titanium dioxide (TiO2). The SAC/TiO2 composite solder were fabricated via powder metallurgy (PM) technique. The five different composition chosen were 0, 0.25, 0.5, 0.75, and 1.0. The results showed that distribution of TiO2 along the grain boundaries has increased the hardness of the SAC/TiO2 composite solders compared to monolithic SAC solder alloy.

Microstructural and phase analysis of Sn-Cu-Ni-XSiC composite solder

The effect of ceramic addition on the Sn-Cu-Ni solder alloy microstructure has been investigated. Sn-Cu-Ni/SiC composite solder samples were fabricated via powder metallurgy (PM) techniques. In this study, five different SiC composition were chosen (0 wt. %, .25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). The results revealed that a small amount of SiC addition has well distributed along the grain boundaries which also refines the β-Sn phase.The effect of ceramic addition on the Sn-Cu-Ni solder alloy microstructure has been investigated. Sn-Cu-Ni/SiC composite solder samples were fabricated via powder metallurgy (PM) techniques. In this study, five different SiC composition were chosen (0 wt. %, .25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). The results revealed that a small amount of SiC addition has well distributed along the grain boundaries which also refines the β-Sn phase.

Effect of Si3N4 Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy

This research has investigated the properties of low-silver Sn-1.0Ag-0.7Cu (SAC107) alloy. Different weight percentages (0, 0.25, 0.5, 0.75 and 1 wt. %) of silicon nitride (Si3N4) were used as reinforcement particles. The SAC107 - Si3N4 composite solder was fabricated via powder metallurgy (PM) technique. The results showed that homogeneous distribution of Si3N4 particles along the grain boundaries has increased the hardness of the SAC107 - Si3N4 composite solders compared to monolithic SAC107 solder alloy. The melting temperature is maintained at the SAC107 level, indicating that the novel composite solder is suitable for existing soldering process.

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

The effect of Si3N4 particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si3N4 particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. The addition of 1.0 wt. % Si3N4 give highest hardness value to the composite solder.

Effect of Zn Additions on Thermal and Mechanical Properties of Sn-0.7Cu-xZn Solder Alloy

This research examines the influences of minor addition of Zn on the thermal and mechanical properties in Sn-0.7Cu solder alloy. The addition of 0.5, 1.0 and 1.5 wt.% of Zn were added into Sn-0.7Cu by using conventional casting method. It show that minor Zn addition has refined and promoted the nucleation of β-Sn phase. The vickers hardness show a increases the hardness of Sn-0.7Cu solder alloy with increasing amount of Zn. For thermal properties, with a small addition of Zn, it did not change the melting but has a slight decrease the undercooling of Sn-0.7Cu solder alloy.

Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging

This paper studied the thermal stability of Sn-0.7Cu (SC) and Sn-0.7Cu-0.05Ni (SCN) solder paste after soldering and during subsequent aging. Isothermal aging was conducted for 24, 240 and 480 hours at a temperature of 75, 125, and 150 °C respectively. Characterization focuses on the morphology of intermetallic compound (IMC) and the thickness of IMC after soldering and aging. In addition, growth kinetics of SC and SCN solder paste was determined by using the power law and Arrhenius relationship. Findings revealed that additions of Ni has formed a new (Cu,Ni)6Sn5 interfacial IMC. Additionally, it was found that scallop-type Cu6Sn5 and uniform scallop-type (Cu,Ni)6Sn5 of IMC for as-reflowed IMC phase has changed into layer-type IMC after aged. Besides that, IMC thickness for both solders has increased with prolong aging time and temperature. The interfacial IMC grew faster at high temperature aging. The activation energy of SCN solder was calculated as 39.8 kJmol-1 better than 27.29 kJmol-1 possess by SC solder. The high activation energy of SCN solder may attribute to the inherently slower reaction of Ni with SCN solder compared to the faster reaction between SC Solder and Cu for the IMC growth. Besides that, Ni addition act as obstacle for the diffusion of Cu atom from the substrate and Sn atom from the solder to react each another.