Motochika Okano

3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver

A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8mm × 1.0mm. Since RF signals are degraded by parasitic capacitance associated with the low height and small footprint of the module, three design techniques are proposed in the paper. The module realizes the worlds smallest size, and achieves sufficient transmitter modulation accuracy and receiver sensitivity, which meet TransferJet™ standards.

Robust design of CMOS wireless SoC for 3D-integrated small transferjet™ module

TransferJet™ is an emerging high-speed close-proximity wireless communication standard, which enables a data transfer of up to 522 Mbps within a few centimeters transmission range. We have designed a fully integrated TransferJetTM SoC with a 4.48-GHz operating frequency and a 560-MHz signal bandwidth using a 65 nm CMOS technology. A module has also been developed employing 3D integration technology. The SoC with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a module size of 4.8 mm × 4.8 mm × 1.0 mm. Since RF signals are sensitive to the low height and small footprint of the module, we propose a waveform pre-emphasis scheme to handle the ultra-wide bandwidth and a programmable power attenuator for precise output power in the transmitter of the SoC to meet the TransferJetTM standard.