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Publication
Featured researches published by Motonobu Kubo.
international microsystems, packaging, assembly and circuits technology conference | 2009
Shao-Ping Shen; Wei-Ping Dow; Motonobu Kubo; Tohru Kamitamari; Eric Cheng; Jing-Yuan Lin; Fu-Chiang Hsu
Through-silicon-via (TSV) technology has been employed for three-dimensional (3D) packaging of multi-chips. A high interwafer interconnect density can be achieved with a minor area penalty. Having shorter signal paths between dies make it possible to improve the systems performance by permitting the system to run faster, alleviate interconnect delay problems, it also consumes less power. Copper has been selected as the through-chop material because of its compatibility with conventional multilayer
Archive | 1992
Hiroki Uchida; Motonobu Kubo; Masayuki Kiso; Teruyuki Hotta; Tohru Kamitamari
Archive | 1992
Hiroki Uchida; Motonobu Kubo; Masayuki Kiso; Teruyuki Hotta; Tohru Kamitamari
한국표면공학회 학술발표회 초록집 | 2008
Shigeo Hashimoto; Akira Okada; Yukinori Oda; Masayuki Kiso; Motonobu Kubo
Archive | 1992
Hiroki Uchida; Motonobu Kubo; Masayuki Kiso; Teruyuki Hotta; Tohru Kamitamari
International Symposium on Microelectronics | 2011
Wei-Ping Dow; Shao-Ping Shen; Chun-Wei Lu; Yiu-Hsiang Chang; Motonobu Kubo; Tohru Kamitamari; Eric Cheng; Jing-Yuan Lin; Fu-Chiang Hsu
Meeting Abstracts | 2010
Wei-Ping Dow; Shao-Ping Shen; Chun-Wei Lu; Yiu-Hsiang Chang; Motonobu Kubo; Tohru Kamitamari; Eric Cheng; Jing-Yuan Lin; Fu-Chiang Hsu
Meeting Abstracts | 2009
Wei-Ping Dow; Wei-Hsiang Chen; Motonobu Kubo; Makoto Sato; Eric Cheng; Jing-Yuan Lin; Fu-Cniang Hsu
Journal of The Surface Finishing Society of Japan | 1997
Motonobu Kubo; Teruyuki Hotta
Journal of The Surface Finishing Society of Japan | 1993
Motonobu Kubo; Tohru Kamitamari; Teruyuki Hotta; Masayuki Kiso; Hiroki Uchida; Tetsuo Ohtaka
