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Nagesh Vodrahalli

Intel

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Publication

Featured researches published by Nagesh Vodrahalli.

Archive | 2000

Electronic assembly comprising solderable thermal interface

Biswajit Sur; Nagesh Vodrahalli; Thomas Workman

Archive | 1997

Emulative lid/heatspreader for processor die attached to an organic substrate

Michael P. Brownell; Nagesh Vodrahalli; James G. Maveery; Richard Michael Ramirez

Archive | 1999

Integrated circuit package having a substrate vent hole

Suresh Ramalingam; Nagesh Vodrahalli; Michael J. Costello; Mun Leong Loke; Ravi Mahajan

Archive | 2001

Electronic assembly comprising solderable thermal interface and methods of manufacture

Biswajit Sur; Nagesh Vodrahalli; Thomas Workman

Archive | 2010

Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit

Nagesh Vodrahalli; Gennady Farber; Hai-Feng Liu; Hamid R. Eslampour; Ut Tran; William Wong; Ruolin Li; Jesper Arentoft Jayaswal

Archive | 2002

Polarization-insensitive planar lightwave circuits and method for fabricating the same

Nagesh Vodrahalli

Archive | 2003

Compact optical package with modular optical connector

Nagesh Vodrahalli; Jaiom S. Sambyal; Biswajit Sur

Archive | 1999

Dielectric decal for a substrate of an integrated circuit package

Venkatesan Murali; Nagesh Vodrahalli; Brian A. Kaiser

Archive | 1999

Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state

Duane Cook; Venkatesan Murali; Suresh Ramalingam; Nagesh Vodrahalli

Archive | 1999

High performance thermal interface curing process for organic flip chip packages

Nagesh Vodrahalli; Biswajit Sur

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Collaboration

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Biswajit Sur

Intel

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Suresh Ramalingam

Intel

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Thomas Workman

Intel

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Michael J. Costello

Intel

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Mun Leong Loke

Intel

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Ravi Mahajan

Intel

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Venkatesan Murali

Intel

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Duane Cook

Intel

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Brian A. Kaiser

Intel

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Connie C. Liu

Intel

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