Nancy Y. Jia

Optical add and drop multiplexer using on-chip integration of planar light circuits and optical microelectromechanical system switching

On-chip integration of optical switches and planar light circuits (PLCs) can greatly reduce the size, manufacturing cost, and operating cost of multicomponent optical systems. A silicon-on-insulator platform for integrating microelectromechanical system (MEMS) latching optical waveguide switches with PLCs is presented including a working example of chip scale integration of reconfigurable-optical add/drop multiplexer and λ-Routers, along with details of the integrated latching MEMS optical switches.

Optical MEMS platform for low-cost on-chip integration of planar light circuits and optical switching

Xerox Corporation has developed a technology platform for on-chip integration of latching MEMS optical waveguide switches and Planar Light Circuit (PLC) components using a Silicon On Insulator (SOI) based process. To illustrate the current state of this new technology platform, working prototypes of a Reconfigurable Optical Add/Drop Multiplexer (ROADM) and a l-router will be presented along with details of the integrated latching MEMS optical switches. On-chip integration of optical switches and PLCs can greatly reduce the size, manufacturing cost and operating cost of multi-component optical equipment. It is anticipated that low-cost, low-overhead optical network products will accelerate the migration of functions and services from high-cost long-haul markets to price sensitive markets, including networks for metropolitan areas and fiber to the home. Compared to the more common silica-on-silicon PLC technology, the high index of refraction of silicon waveguides created in the SOI device layer enables miniaturization of optical components, thereby increasing yield and decreasing cost projections. The latching SOI MEMS switches feature moving waveguides, and are advantaged across multiple attributes relative to alternative switching technologies, such as thermal optical switches and polymer switches. The SOI process employed was jointly developed under the auspice of the NIST APT program in partnership with Coventor, Corning IntelliSense Corp., and MicroScan Systems to enable fabrication of a broad range of free space and guided wave MicroOptoElectroMechanical Systems (MOEMS).

Wax Spreading in Paper under Controlled Pressure and Temperature

This work describes a novel rapid method to fabricate high-resolution paper-based microfluidic devices using wax-ink-based printing. This study demonstrates that both temperature and pressure are important knobs in controlling the device resolution. High-resolution lines and patterns were obtained by heating the paper asymmetrically from one side up to 110 °C while applying pressure up to 49 kPa. Starting with wax lines with an initial width of 130 μm, we achieve a thorough penetration through a 190 μm-thick paper with lateral spreading on the front as narrow as 90 μm. The role of temperature and pressure are systematically studied and compared with the prediction of the Lucas-Washburn equation. We found that the temperature dependence of spreading can be explained by the viscosity change of the wax, according to the Lucas-Washburn equation. The pressure dependence deviates from Lucas-Washburn behavior because of compression of the paper. An optimal condition for achieving full depth penetration of the wax yet minimizing lateral spreading is suggested after exploring various parameters including temperature, pressure, and paper type. These findings could lead to a rapid roll-to-roll fabrication of high-resolution paper-based diagnostic devices.