Joel A. Kubby

Design, modeling and verification of MEMS silicon torsion mirror

This paper presents the design, modeling, and verification of a MEMS silicon torsion mirror for applications in laser printing. It begins with a description of the torsion mirror design, followed by detailed discussions of modeling and verification of the design. A coupled electro-mechanical computer-aided-design software package MEMCAD is used to perform both electrical and mechanical analysis of the mirror under different applied voltages. The MEMCAD modeling results are then post-processed through a program, which retrieves the displacement components of nodes from MEMCAD output and fits a quadratic surface to the deformed reflecting mirror surface. This approximated surface is to be used later in an optical modeling package to analyze the optical performance of the device. The post-processed results are verified by experiential measurements. The first six natural modes of the mirror are determined and are given to help understand the mechanical response of the mirror to different excitation frequencies, Finally, with the aid of MEMCAD, sensitivity analysis for translation versus rotation is performed in order to optimize the mirror design for a raster output scanner (ROS) optical system.

Optical add and drop multiplexer using on-chip integration of planar light circuits and optical microelectromechanical system switching

On-chip integration of optical switches and planar light circuits (PLCs) can greatly reduce the size, manufacturing cost, and operating cost of multicomponent optical systems. A silicon-on-insulator platform for integrating microelectromechanical system (MEMS) latching optical waveguide switches with PLCs is presented including a working example of chip scale integration of reconfigurable-optical add/drop multiplexer and λ-Routers, along with details of the integrated latching MEMS optical switches.

Vibration signature analysis sensors for predictive diagnostics

This paper describes frequency vibration sensors for signature analysis on (electro)mechanical components. The application is predictive diagnostics and condition based maintenance on Xerographic printer and copier products. The vibration signature analysis (VSA) sensing devices consist of micromachined arrays of closely spaced silicon mechanical resonators covering a frequency range of 120 Hz to 100 kHz. Resonance of a particular element is detected with a Wheatstone bridge of implanted piezoresistors and the bridge outputs are multiplexed onto a common output line using on- chip p-MOS transistor switches. The design and fabrication of the VSA devices is presented.

Optical MEMS platform for low-cost on-chip integration of planar light circuits and optical switching

Xerox Corporation has developed a technology platform for on-chip integration of latching MEMS optical waveguide switches and Planar Light Circuit (PLC) components using a Silicon On Insulator (SOI) based process. To illustrate the current state of this new technology platform, working prototypes of a Reconfigurable Optical Add/Drop Multiplexer (ROADM) and a l-router will be presented along with details of the integrated latching MEMS optical switches. On-chip integration of optical switches and PLCs can greatly reduce the size, manufacturing cost and operating cost of multi-component optical equipment. It is anticipated that low-cost, low-overhead optical network products will accelerate the migration of functions and services from high-cost long-haul markets to price sensitive markets, including networks for metropolitan areas and fiber to the home. Compared to the more common silica-on-silicon PLC technology, the high index of refraction of silicon waveguides created in the SOI device layer enables miniaturization of optical components, thereby increasing yield and decreasing cost projections. The latching SOI MEMS switches feature moving waveguides, and are advantaged across multiple attributes relative to alternative switching technologies, such as thermal optical switches and polymer switches. The SOI process employed was jointly developed under the auspice of the NIST APT program in partnership with Coventor, Corning IntelliSense Corp., and MicroScan Systems to enable fabrication of a broad range of free space and guided wave MicroOptoElectroMechanical Systems (MOEMS).

Advances in MEMS integration with planar waveguide devices

Ths paper reviews benefits for the integration of optical components into Photonic Light Circuits (PLCs), with a particular emphasis on the integration of optical switching elements. The requirements for the optical switches in these circuits will be discussed and the suitability of various switching technologies for meeting these requirements will be considered.