Naohide Takamoto

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated wafer back surface protective film

Film for flip chip type semiconductor back surface and its use

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Film for flip chip type semiconductor back surface

FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEGRATED FILM FOR BACK SURFACE OF SEMICONDUCTOR, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet

Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same

THERMALLY RELEASABLE SHEET-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, METHOD OF COLLECTING SEMICONDUCTOR ELEMENT, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE