Naoyuki Hosoda
Mitsubishi
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Publication
Featured researches published by Naoyuki Hosoda.
Microelectronics Reliability | 1986
Naoyuki Hosoda; Naoki Uchiyama; Ryusuke Kawanaka
A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/cm2. The solder exhibits high adhesive strength and good wettability. The properties of this material may be further improved by addition of 1 to 10 wt % of Ag.
Archive | 1989
Naoyuki Hosoda; Masayuki Tanaka; Tamotsu Mori
Archive | 1986
Naoyuki Hosoda; Masaki Morikawa; Naoki Uchiyama; Hideaki Yoshida; Toshiaki Ono
Archive | 1987
Naoyuki Hosoda; Masaki Morikawa; Naoki Uchiyama; Hideaki Yoshida; Toshiaki Ono
Archive | 1974
Tokio Yanagida; Ariyoshi Saito; Naoyuki Hosoda; Fukuzo Kaneko
Archive | 1983
Naoyuki Hosoda; Naoki Uchiyama; Ryuusuke Kawanaka
Archive | 1985
Noboru Sonoda; Naoyuki Hosoda; Kazumasa Hori
Archive | 1989
Naoyuki Hosoda; Masaki Morikawa; Naoki Uchiyama
Archive | 1988
Masaki Morikawa; Naoyuki Hosoda; Naoki Uchiyama
Archive | 1988
Masaki Morikawa; Naoyuki Hosoda; Naoki Uchiyama
