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Dive into the research topics where Masaki Morikawa is active.

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Featured researches published by Masaki Morikawa.


Gold Bulletin | 1984

Surface hardened gold alloys

Fukuhisa Matsuda; Kazuhiro Nakata; Masaki Morikawa

A process for the surface hardening of high gold-content alloys would improve their performance in a variety of applications. The effects on their hardnesses of heating pure gold and alloys of gold, containing titanium, chromium, nickel or iron, with boron powder in an argon atmosphere at 900 to 950 °C for six hours have therefore been studied. The findings are reported in this article.


Archive | 1981

Method for manufacturing stripe-patterned metal plate

Yo Takeuchi; Masaki Morikawa; Chuji Tanaka; Toshiharu Hiji; Hiroshi Ikeda


Archive | 1986

Wire for bonding a semiconductor device and process for producing the same

Naoyuki Hosoda; Masaki Morikawa; Naoki Uchiyama; Hideaki Yoshida; Toshiaki Ono


Archive | 2011

Method and apparatus for manufacturing vitreous silica crucible

Hiroshi Kishi; Minoru Kanda; Masaki Morikawa


Archive | 1984

Copper alloy having high resistance to oxidation for use in leads on semiconductor devices

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida


Archive | 1983

Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida


Archive | 2009

Silica glass crucible for pulling up silicon single crystal and method for manufacturing thereof

Kazuhiro Harada; Masaki Morikawa; Satoshi Kudo


Archive | 2008

Method and apparatus for manufacturing quartz glass crucible

Hiroshi Kishi; Minoru Kanda; Masaki Morikawa


Archive | 1992

SPUTTERING TARGET AND MANUFACTURE THEREFOR

Toshinori Ishii; Makoto Kinoshita; Kunio Kishida; Masaki Morikawa; 邦雄 岸田; 真 木下; 正樹 森川; 利昇 石井


Archive | 1987

Wire for bonding a semiconductor device

Naoyuki Hosoda; Masaki Morikawa; Naoki Uchiyama; Hideaki Yoshida; Toshiaki Ono

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