Naseem Y. Aziz

MIRAGE read-in integrated circuit testing results

This paper describes the test results for the MIRAGE read- in-integrated-circuit (RIIC) designed by Indigo Systems Corporation. This RIIC, when mated with suspended membrane, micro-machined resistive elements, forms a highly advanced emitter array. This emitter array is used by Indigo and Santa Barbara Infrared Incorporated in a jointly developed product for infrared scene generation, called MIRAGE. The MIRAGE RIIC is a 512 X 512 pixel design which incorporates a number of features that extend the state of the art for emitter array RIIC devices. These innovations include an all-digital interface for scene data, snapshot image updates (all pixels show the new frame simultaneously), frame rates up to 200 Hz, operating modes that control the device output, power consumption, and diagnostic configuration. Tests measuring operating speed, RIIC functionality and D/A converter performance were completed. At 2.1 X 2.3 cm, this die is also the largest nonstitched device ever made by Indigos foundry, American Microsystems Incorporated. As with any IC design, die yield is a critical factor that typically scales with the size and complexity. Die yield, and a statistical breakdown of the failures observed will be discussed.

Standardized high performance readout integrated circuits enable rapid development of QWIP imaging systems

Abstract This paper describes standardized high performance 320 by 256 (ISC9705 or ‘Standard 320’) and 640 by 512 (ISC9803 or ‘Standard 640’) readout integrated circuits (ROICs) for detectors such as InSb, InGaAs, and QWIP, including presentation of focal plane array (FPA) test results for QWIP FPAs fabricated on the ISC9705 and ISC9803 ROICs. The availability of detector interface layout databases, complete test results for each die, and off-the-shelf imaging electronics enable rapid development of imaging systems using QWIP detector arrays. The ROICs are intended to support a wide range of systems through flexibility and advanced modes of operation, and include features such as high-detector bias, programmable gain and signal ‘skimming’ to improve the performance of QWIP FPAs fabricated with these devices. The ROICs also support such advanced features as dynamic image transposition, dynamic windowing, multiple high-speed output configurations, and flexible snapshot integration. These arrays are part of the Indigo Systems family of standard ROICs that share a common architecture and electrical interface.

A high performance 1024 × 1024 digital x-ray panel with integrated readout electronics for nondestructive testing and medical imaging applications

Prime View International (PVI) has developed a 4 times 4- inch digital X-ray panel with 1024 times 1024 resolution. The panel is built with a-Si PIN diodes and thin-film transistors (TFTs) for the detector array with readout integrated circuits (ROICs) from FLIR Systems Inc. The panels integrated electronics are capable of on-chip low-pass filtering, correlated double sampling, and programmable 9 to 14-bit analog-to-digital conversion. The detector panel is read out using eight FLIR Systems 128-channel 80-micrometer-pitch readout integrated circuits (ISC9717) abutted along the columns of the 1024 x 1024 detector array. The pixel size of detector array is 100 micrometers and fabricated by a standard TFT process plus an exclusive PIN process. This high performance, digitally integrated X-ray imaging solution is especially suitable to meet the rising demands of industrial nondestructive testing and medical imaging applications.