Neil T. Gordon

High-performance long-wavelength HgCdTe infrared detectors grownon silicon substrates

Long-wavelength HgCdTe heterostructures on silicon (100) substrates have been grown using metal-organic vapor phase epitaxy. Test diodes have been fabricated from this material using mesa technology and flip-chip bonding. We have demonstrated excellent resistance-area product characteristics for diodes with a 10.2μm cutoff wavelength. R0A values approaching 103Ωcm2 at 80K have been measured and the resistance-area product maintained above 102Ωcm2 at 1V reverse bias. Variable temperature R0A values correspond to expected generation-recombination loss mechanisms between 60 and 120K. Current-voltage characteristics of two diodes at opposite sides of an array indicate that a very uniform imaging long-wavelength infrared array could be fabricated from this material.

Long-wavelength HgCdTe negative luminescent devices

We have investigated the negative luminescent properties of a HgCdTe device, fabricated from a 1 mm diameter array of photodiodes having peak emission at a wavelength of 8.5 μm. This long-wavelength luminescence is of sufficient efficiency and area to be useful in device applications.

Photomultiplication with low excess noise factor in MWIR to optical fiber compatible wavelengths in cooled HgCdTe mesa diodes

Infrared avalanche diodes are key components in diverse applications such as eye-safe burst illumination imaging systems and quantum cryptography systems operating at telecommunications fiber wavelengths. HgCdTe is a mature infrared detector material tunable over all infrared wavelengths longer than ~850nm. HgCdTe has fundamental properties conducive to producing excellent detectors with low noise gain. The huge asymmetry between the conduction and valence bands in HgCdTe is a necessary starting point for producing impact ionization with low excess noise factor. Other factors in the band structure are also favorable. The low bandgap necessitates at least multi-stage thermoelectric cooling. Mesa diode structures with electron initiated multiplication have been designed for gains of up to around 100 at temperatures at or above 80K. Backside illuminated, flip-chip, test diode arrays have been fabricated by MOVPE using a process identical to that required for producing large imaging arrays. Test diode results have been obtained with the following parameters characterized, dark current vs. voltage and temperature, gain vs. voltage, and spectral response as a function of wavelength and bias. The effect of changing active region cadmium composition and active region doping is presented along with an assessment of some of the trade-offs between dark leakage current, gain, operating voltage and temperature of operation.

Micromachined optical concentrators for IR negative luminescent devices

Negative luminescent (NL) devices, which to an IR observer appear colder than they actually are, have a wide range of possible applications, including use as thermal radiation shields in IR cameras, and as IR sources in gas-sensing systems. For many of these applications a large area (>1 cm2) device which displays as large as possible apparent temperature range is required. However, under reverse bias, significant currents are required to reduce the carrier concentrations to the levels needed for maximum possible absorption. We have therefore used a novel micromachining technique to fabricate integrated optical concentrators in InSb/InAlSb and HgCdTe NL devices. Smaller area diodes can then be used to achieve the same absorption (e.g. for InSb an area reduction of 16 is possible) and the required currents are thus reduced. To fabricate the concentrators, spherical resist masks are first produced, which are ∼10 μm high and ∼53 μm wide, by resist reflow at 120°C. Inductively coupled plasma (ICP) etching is then used to etch alternately the resist mask and the semiconductor, with oxygen and methane/hydrogen respectively, producing concentrators with almost parabolic profiles. Currently, the concentrators are typically 30 μm high, with a top diameter of ∼15 μm. Continuing optimization of the process to reach the theoretical limits of optical gain is described.

InSb/AlInSb quantum-well light-emitting diodes

We have investigated the room-temperature electroluminescent properties of InSb∕AlxIn1−xSb quantum-well light-emitting diodes. The maximum emission from diodes containing quantum wells occurred at significantly higher energies than the band gap of InSb. Close agreement between experimental and theoretical data confirms that recombination occurs within the quantum well.

Coded aperture systems as non-conventional lensless imagers for the visible and infrared

Coded aperture imaging (CAI) has been used extensively at gamma- and X-ray wavelengths, where conventional refractive and reflective techniques are impractical. CAI works by coding optical wavefronts from a scene using a patterned aperture, detecting the resulting intensity distribution, then using inverse digital signal processing to reconstruct an image. This paper will consider application of CAI to the visible and IR bands. Doing so has a number of potential advantages over existing imaging approaches at these longer wavelengths, including low mass, low volume, zero aberrations and distortions and graceful failure modes. Adaptive coded aperture (ACAI), facilitated by the use of a reconfigurable mask in a CAI configuration, adds further merits, an example being the ability to implement agile imaging modes with no macroscopic moving parts. However, diffraction effects must be considered and photon flux reductions can have adverse consequences on the image quality achievable. An analysis of these benefits and limitations is described, along with a description of a novel micro optical electro mechanical (MOEMS) microshutter technology for use in thermal band infrared ACAI systems. Preliminary experimental results are also presented.

Dual-waveband infrared focal plane arrays using MCT grown by MOVPE on silicon substrates (Invited Paper)

Dual-waveband, Focal Plane Arrays (FPAs) based on Hg1-xCdxTe multi-layer structures have previously been produced by the Molecular Beam Epitaxy (MBE) growth technique. It is shown that the multi-layer structures required for dual-waveband devices can also be grown by Metal Organic Vapor Phase Epitaxy (MOVPE). The MOVPE growth process allows excellent control of both the composition and doping profiles and has the advantage of allowing growth on a range of substrates including silicon. Previous research on back-to-back diodes for dual-waveband has concentrated on npn structures. The design of the alternative pnp structures is discussed and a model is developed which gives a good fit to the measured spectra. We report on the design and characterization of dual-waveband detectors including current-voltage and spectral cross talk for the case of two close sub-bands within the 3-5 μm mid-wave infrared (MWIR) spectral range. The mechanisms for spectral cross talk are discussed including incomplete absorption, transistor action and radiative coupling. A custom readout circuit (ROIC) has been designed. This allows the capture of data from the two bands which is spatially aligned but sequential in time.

Epitaxial InSb for elevated temperature operation of large IR focal plane arrays

The use of epitaxially grown indium antimonide (InSb) has previously been demonstrated for the production of large 2D focal plane arrays. It confers several advantages over conventional, bulk InSb photo-voltaic detectors, such as reduced cross-talk, however here we focus on the improvement in operating temperature that can be achieved because more complex structures can be grown. Diode resistance, imaging, NETD and operability results are presented for a progression of structures that reduce the diode leakage current as the temperature is raised above 80K, compared with a basic p+-n-n+ structure presented previously. These include addition of a thin region of InAlSb to reduce p-contact leakage current, and construction of the whole device from InAlSb to reduce thermal generation in the active region of the detector. An increase in temperature to 110K, whilst maintaining full 80K performance, is achieved, and imaging up to 130K is demonstrated. This gives the prospect of significant benefits for the cooling systems, including, for example, use of argon in Joule-Thomson coolers or an increase in the life and/or decrease in the cost; power consumption and cool-down time of Stirling engines by several tens of per cent.

Multi-color IRFPAs made from HgCdTe grown by MOVPE

The drive towards improved target recognition has led to an increasing interest in detection in more than one infrared band. This paper describes the design, fabrication and performance of two-colour and three-colour infrared detectors made from HgCdTe grown by Metal Organic Vapour Phase Epitaxy (MOVPE). The detectors are staring, focal plane arrays consisting of HgCdTe mesa-diode arrays bump bonded to silicon read-out integrated circuits (ROICs). Each mesa diode has one connection to the ROIC and the colours are selected by varying the applied bias. Results will be presented for both two-colour and three-colour devices. In a two-colour n-p-n design the cut-off wavelengths are defined by the compositions of the two n-type absorbers and the doping and composition of the p-type layer are chosen to prevent transistor action. The bias polarity is used to switch the output between colours. This design has been used to make MW/LW detectors with a MW band covering 3 to 5 μm and a LW band covering 5 to 10 μm. In a three-colour n-p-n design the cut-off wavelengths are defined by the compositions of the two n-type absorbers and the p-type absorber, which has an intermediate cut-off wavelength. The absorbers are separated from each other by electronic barriers consisting of wide band-gap material. At low applied bias these barriers prevent photo-electrons generated in the p-type absorber from escaping and the device then gives an output from one of the n-type absorbers. At high applied bias the electronic barrier is pulled down and the device gives an output from both the p-type absorber and one of the n-type absorbers. Thus by varying the polarity and magnitude of the bias it is possible to obtain three-colours from a two-terminal device. This design has been used to make a SW/MW/MW detector with cut-off wavelengths of approximately 3, 4 and 6 μm.

Long-wavelength HgCdTe on silicon negative luminescent devices

We have investigated the negative luminescent properties of a device fabricated from metalorganic vapor phase epitaxy grown HgCdTe on a Si substrate. The peak emission was at 7.2μm, and the intrinsic Auger processes were found to be very well suppressed. The low currents (minimum current density, Jmin, of 0.84A∕cm2 at 295K) needed to drive these devices makes them suitable for a range of device applications.