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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Nicholas R. Watts is active.

Publication


Featured researches published by Nicholas R. Watts.


Archive | 2009

Semiconductor package with embedded die and its methods of fabrication

John S. Guzek; Javier Soto Gonzalez; Nicholas R. Watts; Ravi K. Nalla


Archive | 2003

Via including multiple electrical paths

Todd B. Myers; Nicholas R. Watts; Eric Palmer; Renee M Defeo; Jui Min Lim


Archive | 2000

Electronic circuit housing with trench vias and method of fabrication therefor

David G. Figueroa; Nicholas R. Watts


Archive | 2010

Method of stiffening coreless package substrate

Sriram Muthukumar; Nicholas R. Watts; John S. Guzek


Archive | 2010

ELECTROLYTIC DEPOSITON AND VIA FILLING IN CORELESS SUBSTRATE PROCESSING

Tao Wu; Nicholas R. Watts


Archive | 2003

Laminated capacitor and its manufacturing method, and wiring board, decoupling circuit and high-frequency circuit incorporating the same

David G. Figueroa; Takeshi Hioki; Nicholas L Holmberg; Haruo Hori; Yoichi Kuroda; Yasuyuki Naito; Jorge P. Rodriguez; Masaaki Taniguchi; Nicholas R. Watts; デヴィット ジー フィゲロア; ニコラス アール ワッツ; ニコラス エル ホルンバーグ; ホルヘ ピー ロドリゲス; 内藤 康行; 堀 晴雄; 日置 剛; 谷口 政明; 黒田 誉一


Archive | 2007

Method of embedding passive component within via

Todd B. Myers; Nicholas R. Watts; Eric Palmer; Jui Min Lim


Archive | 2013

Passive within via

Todd B. Myers; Nicholas R. Watts; Eric Palmer; Jui Min Lim


Archive | 2011

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES

Russell K. Mortensen; Robert Nickerson; Nicholas R. Watts


Archive | 2011

PIN GRID INTERPOSER

Nicholas R. Watts; Tao Wu

Collaboration


Dive into the Nicholas R. Watts's collaboration.

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