Nicholas Tiliakos
Columbia University
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Nicholas Tiliakos.
IEEE\/ASME Journal of Microelectromechanical Systems | 2008
Matthew McCarthy; Nicholas Tiliakos; Vijay Modi; Luc G. Fréchette
In this paper, thermal buckling of doubly clamped microfabricated nickel beams is implemented as a passive actuation mechanism to drive temperature-regulated nonlinear micro-valves for adaptive microcooling applications. The nonlinear buckling phenomenon is combined with the nonlinear change in flow rate through parallel plates with a variable spacing. The thermal buckling mechanism and parallel plate flow are modeled analytically, and nondimensional characteristic design curves have been generated. Passive flow-control microvalves were fabricated using deep reactive ion etching and a through-mold nickel electroplating process over a thin sacrificial layer. The model is validated with experimental results from the microfabricated temperature-regulated microvalves. Experimental characterization using an integrated micromachined heat exchanger with air as the working fluid shows the desired nonlinear valving behavior with mass flow rates of up to 5 mg/s for a temperature increase of 50degC, corresponding to 0.25 W of heat removal. It is shown that temperature-induced elastic instabilities in microfabricated structures can be modeled and manipulated to create a nonlinear adaptive valving mechanism. The modeling approach, microfabrication process, and full characterization of the microvalves are presented.
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference | 2009
A. O'Grady; Ronan Larger; Nicholas Tiliakos; George Papadopoulos; Vijay Modi; Luc G. Fréchette
A floating-element capacitive MEMS shear stress flow sensor was fabricated and shown to successfully measure mean-turbulent skin friction in high-speed compressible duct flow. The sensor was designed for harsh environments (e.g. high-temperature, high-shear stress) with novel through-substrate interconnects for robust packaging and remote circuitry for capacitance measurement. This paper extends our previous work on the MEMS shear stress sensor design [1] and backside interconnect process development [2] to provide complete device fabrication and testing in a high-speed flow.
ASME/JSME 2007 5th Joint Fluids Engineering Conference | 2007
Nicholas Tiliakos; George Papadopoulos; Andrew M. O’Grady; Vijay Modi; Ronan Larger; Luc G. Fréchette
Micro-electro-mechanical systems (MEMS) are an enabling technology that has lead to various miniature sensor concepts. Utilizing recent advances in silicon carbide (SiC) MEMS fabrication techniques allows for the development of a new series of sensors that leverages the high temperature capabilities of SiC. One such sensor concept is a shear stress sensor that can operate over a high dynamic range, and at very high temperatures, with an application emphasis on ground and flight testing in supersonic and hypersonic flow. The application of this fundamental sensor element and capacitance sensing design to very high temperature and very high shear environment, however, brings another set of challenges that involve the associated packaging and electrical control scheme. While this project is still a work in progress, we present an overview of our efforts to design, develop, fabricate and test a MEMS shear stress sensor for hypersonic aeropropulsion test and evaluation applications.
26th AIAA Aerodynamic Measurement Technology and Ground Testing Conference | 2008
Nicholas Tiliakos; George Papadopoulos; Vijay Modi; Ronan Larger; Luc G. Fréchette
Micro-electro-mechanical systems (MEMS) are an enabling technology that has led to various miniature sensor concepts. One such sensor concept is a shear stress sensor that can operate over a wide dynamic range, and at very high temperatures, with an application emphasis on ground and flight testing in supersonic and hypersonic flow. In this paper we present our research and development efforts for a MEMS-based shear stress sensor that can be used to directly measure the shear stress on ground based articles tested in high speed tunnels, and eventually on flight-test articles. Preliminary data showing sensor operation in high subsonic flow is presented and discussed.
ASME 2005 International Mechanical Engineering Congress and Exposition | 2005
Matthew McCarthy; Nicholas Tiliakos; Vijay Modi; Luc G. Fréchette
The design, fabrication and testing of micromachined nickel beams buckling under thermal loading will be presented in this paper. The focus will be on characterizing key design parameters important to the implementation of electroplated nickel beams as the actuation mechanism in a thermally adaptive microvalve. An analytical model of the thermal buckling phenomena has been developed and validated with test results from electroplated nickel beams with slight eccentricities. Highly nonlinear deflection versus temperature curves were predicted by the closed form model and match well with experimental measurements. Buckling deflections of more than 50μm were achieved at actuation temperatures under 100°C. The nickel beam fabrication process will be presented, as well as various fabrication related issues impacting the actuation capabilities of the beams.Copyright
AIAA Infotech@Aerospace 2010 | 2010
George Papadopoulos; Nicholas Tiliakos; Gabriel Benel; Clint Thomson
The development of a new sensor for in-situ non-intrusive measurements of recession rate of heat shield ablative materials is described. The sensor utilizes a focused ultrasound approach to non-intrusively detect the ablative materials surface loss while simultaneously correcting for acoustic velocity dependencies on temperature. The latter correction is done via a closed loop feedback approach that yields the average acoustic velocity through the ablative material. The multi-source focusing approach is atypical of current ultrasound based sensors used for ablation recession rate measurement, which require a-priori knowledge of temperature distribution within the ablative to yield accurate data on recession rate. The paper describes the early development of the sensor system resulting in a proof-of-concept breadboard system that demonstrates its unique operational aspects and possibilities as a heat shield health monitoring system for future spacecraft.
50th AIAA Aerospace Sciences Meeting including the New Horizons Forum and Aerospace Exposition | 2012
George Papadopoulos; Nicholas Tiliakos; Clint Thomson
The development of a new sensor system for in-situ, real-time measurements of recession rate of heat shield ablative materials is described. The sensor utilizes a focused ultrasound approach to non-intrusively detect the ablative materials surface loss while simultaneously correcting for acoustic velocity dependencies on temperature. The latter correction is done via a closed loop feedback approach. The multi-source focusing approach is atypical of current ultrasound based sensors used for ablation recession rate measurement, which require a-priori knowledge of temperature distribution within the ablative to yield accurate data on recession rate. The paper describes the operating principles of the sensor and reports on results obtained in testing the breadboard sensor system in a relevant environment at ATK GASL’s POET facility.
Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B | 2011
George Papadopoulos; Nicholas Tiliakos; Gabriel Benel
The design, fabrication and preliminary performance of a variable density pin array micro heat exchanger for micro-cooling applications is reported. Various pin diameters and density configurations were analyzed for their ability to provide maximum uniform heat transfer over the active area of the micro-heat exchanger using air as the working fluid for maximum mass flow rates through the micro-heat exchanger in the range of 40 mg/sec to 60 mg/sec. Fabrication of the micro-heat exchanger was performed using deep reactive ion etching (DRIE) technique on a 0.5 mm thick silicon wafer with nominal feature sizes in the range of 5 microns to 20 microns. Performance data is presented based on analysis and comparison to a baseline configuration with no pins.Copyright
Sensors and Actuators A-physical | 2007
Matthew McCarthy; Nicholas Tiliakos; Vijay Modi; Luc G. Fréchette
Archive | 2006
Matthew McCarthy; Vijay Modi; Luc G. Fréchette; Nicholas Tiliakos