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Nirupama Chakrapani

Intel

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Publication

Featured researches published by Nirupama Chakrapani.

Archive | 2007

Microelectronic package including thermally conductive sealant between heat spreader and substrate

Ashish Gupta; Leonel R. Arana; David Song; Chia-Pin Chiu; Ravi Prasher; Chris Matayabas; Nirupama Chakrapani

Archive | 2005

Negative thermal expansion material filler for low CTE composites

Nirupama Chakrapani; James Chris Matayabas; Paul A. Koning

Archive | 2011

Electronic packages with fine particle wetting and non-wetting zones

Nirupama Chakrapani; Vijay Wakharkar; Chris Matayabas

Archive | 2006

Controlling flow of underfill using polymer coating and resulting devices

Gopalakrishnan Subramanian; Nirupama Chakrapani; Lawrence D. Decesare; Shripad Gokhale; Jason Murphy; Jinlin Wang

Archive | 2007

Controlling substrate surface properties via colloidal coatings

Gopalakrishnan Subramanian; Nirupama Chakrapani; Larry DeCesare; Shripad Gokhale; Jason Murphy; Jinlin Wang

Archive | 2006

Applications of smart polymer composites to integrated circuit packaging

Nirupama Chakrapani; James Chris Matayabas; Vijay Wakharkar

Archive | 2008

Electronic packages with roughened wetting and non-wetting zones

Nirupama Chakrapani

Archive | 2005

Substrate core polymer nanocomposite with nanoparticles and randomly oriented nanotubes and method

Nachiket R. Raravikar; Ravindra V. Tanikella; Nirupama Chakrapani

Archive | 2007

Controlled fluid delivery in a microelectronic package

Lakshmi Supriya; James C. Matayabas; Nirupama Chakrapani

Archive | 2008

MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING

Nirupama Chakrapani; Vijay Wakharkar; Janet Feng; Nisha Ananthakrishnan; Shankar Ganapathysubranian; Gregory S. Constable

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Vijay Wakharkar

Intel

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James Chris Matayabas

Intel

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Jr. James Chandler Matayabas

Intel

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Chris Matayabas

Intel

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Gopalakrishnan Subramanian

Intel

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James C. Matayabas

Intel

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Jason Murphy

Intel

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Jinlin Wang

Intel

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Shripad Gokhale

Intel

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Ashish Gupta

Intel

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