Nobuyuki Ushifusa

Integrated circuit package having heat sink bonded with resinous adhesive

An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include one or more fillers, having a Youngs modulus of 500 kg/cm2 or less when formed into a film, has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks.

Screen printed finger electrode with high aspect ratio by single printing for crystal Si solar cell using novel screen mask

We developed novel screen mask with repellent property to organic solvent containing in Ag paste to print finger electrode with high aspect ratio by single printing and to reduce bleeding caused by spreading the paste at the edge of electrode line. The average height of finger electrode is 40.6 μm and average width is 64.0 μm when using the mask with 40 μm thick emulsion layer composed of 30μm hard layer and 10μm soft layer. The designed opening for electrode is 60 μm.