Noren Pan

GaInP/GaAs collector-up tunneling-collector heterojunction bipolar transistors (C-up TC-HBTs): optimization of fabrication process and epitaxial layer structure for high-efficiency high-power amplifiers

This paper describes a novel heterojunction bipolar transistor (HBT) structure, the collector-up tunneling-collector HBT (C-up TC-HBT), that minimizes the offset voltage V/sub CE,sat/ and the knee voltage V/sub k/. In this device, a thin GaInP layer is used as a tunnel barrier at the base-collector (BC) junction to suppress hole injection into the collector, which results in small V/sub CE,sat/. Collector-up configuration is used because of the observed asymmetry of the band discontinuity between GaInP and GaAs depending on growth direction. To minimize V/sub k/, we optimized the epitaxial layer structure as well as the conditions of ion implantation into the extrinsic emitter and post-implantation annealing. The best results were obtained when a 5-nm-thick 5/spl times/10/sup 17/-cm/sup -3/-doped GaInP tunnel barrier with a 20-nm-thick undoped GaAs spacer was used at the BC junction, and when 2/spl times/10/sup 12/-cm/sup -2/ 50-keV B implantation was employed followed by 10-min annealing at 390/spl deg/C. Fabricated 40/spl times/40-/spl mu/m/sup 2/ C-up TC-HBTs showed almost zero V/sub CE,sat/ (<10 mV) and a very small V/sub k/ of 0.29 V at a collector current density of 4 kA/cm/sub 2/, which are much lower than those of a typical GaInP/GaAs HBT. The results indicate that the C-up TC-HBTs are attractive candidates for high-efficiency high power amplifiers.

Role of neutral base recombination in high gain AlGaAs/GaAs HBT's

Neutral base recombination is a limiting factor controlling the maximum gain of AlGaAs/GaAs HBTs with base sheet resistances between 100 and 350 /spl Omega///spl square/. In this work, we investigate five series of AlGaAs/GaAs HBT growths in which the base thickness was varied between 500 and 1600 /spl Aring/ and the base doping level between 2.9/spl times/ and 4.7/spl times/10/sup 19/ cm/sup -3/. The dc current gain of large area devices (L=75 /spl mu/m/spl times/75 /spl mu/m) varies by as much as a factor of two at high injection levels for a fixed base sheet resistance, depending on the growth optimization. One of these series (Series TA) has the highest current gains ever reported in this base sheet resistance range, with dc current gains over 225 (@ 200 A/cm/sup 2/) at a base sheet resistance of 330 /spl Omega///spl square/. A high dc current gain of 220 (@ 10 kA/cm/sup 2/) was also confirmed in small area devices (L=8 /spl mu/m/spl times/8 /spl mu/m). High-frequency tests on a separate set of wafers grown under the same conditions indicate these high current gains can be achieved without compromising the RF characteristics: Both high and normal gain devices exhibit an f/sub t//spl sim/68 GHz and f/sub max//spl sim/100 GHz. By fitting the base current as a sum of two components, one due to recombination in the neutral base and the other in the space charge region, we conclude that an improvement in the minority carrier lifetime is responsible for the observed increase in dc current gain. Moreover, we observe a thickness-dependent variation in the effective minority carrier lifetime as the gains increase, along with a nonlinear dependence of current gain on base doping. Both phenomena are discussed in terms of an increase in Auger and radiative recombination relative to Hall-Shockley-Read recombination in optimized samples.

Metalorganic chemical vapor deposition of AlGaAs and InGaP heterojunction bipolar transistors

Abstract Heterojunction bipolar transistors (HBT) are now beginning to be widely incorporated as power amplifiers, laser drivers, multiplexers, clock data recovery circuits, as well as transimpedance and broadband amplifiers in high performance millimeter wave circuits (MMICs). The increasing acceptance of this device is principally due to advancements in metalorganic chemical vapor deposition (MOCVD), device processing, and circuit design technologies. Many of the DC electrical characteristics of large area devices can be directly correlated to the DC performance of small area RF devices. A precise understanding of the growth parameters and their relationship to device characteristics is critical for ensuring the high degree of reproducibility required for low cost high-yield volume manufacturing. Significant improvements in the understanding of the MOCVD growth process have been realized through the implementation of statistical process control on the key HBT device parameters. This tool has been successfully used to maintain the high quality of the device characteristics in high-volume production of 4″ GaAs-based HBTs. There is a growing demand to migrate towards 6″ diameter wafer size due to the potential cost reductions and increased volume production that can be realized. Preliminary results, indicating good heterostructure layer characteristics, demonstrate the feasibility of 6″ InGaP-based HBT devices.