Noritake Hiyoshi
Ishikawa National College of Technology
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Publication
Featured researches published by Noritake Hiyoshi.
electronics packaging technology conference | 2014
Noritake Hiyoshi; Mitsuo Yamashita; Hiroaki Hokazono
This paper discusses the effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures. Sn-Bi solders are lower melting point materials, so that it is useful for low temperature soldering. Crack initiation and propagation behavior of three kinds of Sn-Bi solders were observed in this study. There were effects of additive elements Ag, Cu, Ni and Ge on crack propagation rate although there was no effect on crack initiation. The crack propagation of Sn57.5Bi0.5AgCuNiGe solder seems to have a slower rate than Sn58Bi and Sn57.5Bi0.5Ag solders. The J-integral range parameter evaluates the crack propagation rate independent of the additive elements at high temperatures.
Journal of The Society of Materials Science, Japan | 2009
Noritake Hiyoshi; Takamoto Itoh; Masao Sakane
Journal of The Society of Materials Science, Japan | 2017
Hideyuki Kanayama; Noritake Hiyoshi; Takamoto Itoh; Fumio Ogawa; Takashi Wakai
The proceedings of the JSME annual meeting | 2002
Akihisa Katoh; Noritake Hiyoshi; Masao Sakane; Yutaka Tsukada; Hideo Nishimura
The Proceedings of the Materials and Mechanics Conference | 2017
Yuta Takada; Takahiro Morishita; Noritake Hiyoshi; Fumio Ogawa; Takamoto Itoh
Journal of The Society of Materials Science, Japan | 2017
Noritake Hiyoshi
Journal of The Society of Materials Science, Japan | 2017
Noritake Hiyoshi; Mitsuo Yamashita; Hiroaki Hokazono
Journal of The Society of Materials Science, Japan | 2016
Noritake Hiyoshi
european microelectronics and packaging conference | 2011
Noritake Hiyoshi; Takamoto Itoh; Masao Sakane
Journal of The Society of Materials Science, Japan | 2010
Noritake Hiyoshi
