Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Noritake Hiyoshi is active.

Publication


Featured researches published by Noritake Hiyoshi.


electronics packaging technology conference | 2014

Effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures

Noritake Hiyoshi; Mitsuo Yamashita; Hiroaki Hokazono

This paper discusses the effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures. Sn-Bi solders are lower melting point materials, so that it is useful for low temperature soldering. Crack initiation and propagation behavior of three kinds of Sn-Bi solders were observed in this study. There were effects of additive elements Ag, Cu, Ni and Ge on crack propagation rate although there was no effect on crack initiation. The crack propagation of Sn57.5Bi0.5AgCuNiGe solder seems to have a slower rate than Sn58Bi and Sn57.5Bi0.5Ag solders. The J-integral range parameter evaluates the crack propagation rate independent of the additive elements at high temperatures.


Journal of The Society of Materials Science, Japan | 2009

Development of Thermal Mechanical Fatigue Testing Machine for Solders

Noritake Hiyoshi; Takamoto Itoh; Masao Sakane


Journal of The Society of Materials Science, Japan | 2017

Effect of Specimen Size and Oxygen Partial Pressure on Creep Characteristics for Mod. 9Cr-1Mo Steel

Hideyuki Kanayama; Noritake Hiyoshi; Takamoto Itoh; Fumio Ogawa; Takashi Wakai


The proceedings of the JSME annual meeting | 2002

Low Cycle Fatigue of Sn-37Pb and Sn-3.5Ag Solders at Low Temperatures

Akihisa Katoh; Noritake Hiyoshi; Masao Sakane; Yutaka Tsukada; Hideo Nishimura


The Proceedings of the Materials and Mechanics Conference | 2017

Multiaxial Fatigue Property under Cyclic Inner Pressure and Cyclic Axial Loading

Yuta Takada; Takahiro Morishita; Noritake Hiyoshi; Fumio Ogawa; Takamoto Itoh


Journal of The Society of Materials Science, Japan | 2017

Tackles for Normalization/Standardization of Material Tests at High Temperatures: I: Tensile, Creep and Low Cycle Fatigue Testing Standard for Solders and Testing Technique@@@1.はんだの引張・クリープ・低サイクル疲労試験法 -必要性とその試験技術-

Noritake Hiyoshi


Journal of The Society of Materials Science, Japan | 2017

Effect of Additive Elements on Crack Initiation and Propagation Behavior at Stress Concentration Part for Sn-58Bi Solders

Noritake Hiyoshi; Mitsuo Yamashita; Hiroaki Hokazono


Journal of The Society of Materials Science, Japan | 2016

1 帯川 利之/笹原 弘之/齊藤 卓志/谷 泰弘/平田 敦/吉野 雅彦 著 2 池野 順一/大竹 尚登/国枝 正典/長藤 圭介/新野 俊樹 著(講談社発行)

Noritake Hiyoshi


european microelectronics and packaging conference | 2011

Thermo-mechanical fatigue life evaluation for Sn-Pb and Sn-Ag solders

Noritake Hiyoshi; Takamoto Itoh; Masao Sakane


Journal of The Society of Materials Science, Japan | 2010

Report on 7th China-Japan Bilateral Symposium on High Temperature Strength of Materials

Noritake Hiyoshi

Collaboration


Dive into the Noritake Hiyoshi's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar

Fumio Ogawa

Ritsumeikan University

View shared research outputs
Top Co-Authors

Avatar
Top Co-Authors

Avatar

Mitsuo Yamashita

Shibaura Institute of Technology

View shared research outputs
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar

Takashi Wakai

Japan Atomic Energy Agency

View shared research outputs
Top Co-Authors

Avatar

Yuta Takada

Ritsumeikan University

View shared research outputs
Researchain Logo
Decentralizing Knowledge