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Dive into the research topics where Noriyuki Nagashima is active.

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Featured researches published by Noriyuki Nagashima.


Archive | 2002

Method of manufacturing prepreg, prepreg obtained with the same method, method of manufacturing copper foil with insulation layer, and copper foil with insulation layer manufactured with the same method

Noriyuki Nagashima; Tetsuro Sato; 哲朗 佐藤; 憲幸 長嶋


Archive | 2003

COPPER FOIL WITH INSULATOR LAYER, ITS MANUFACTURING METHOD, AND MULTILAYER PRINTED CIRCUIT BOARD USING IT

Noriyuki Nagashima; Kensuke Nakamura; Tetsuro Sato; 健介 中村; 哲朗 佐藤; 憲幸 長嶋


Archive | 2002

PRODUCTION METHOD, OF COPPER FOIL WITH INSULATING LAYER OBTAINED COPPER FOIL WITH INSULATING LAYER OBTAINED BY THE METHOD AND PRINTED WIRING BOARD USING COPPER FOIL WITH INSULATING LAYER

Noriyuki Nagashima; Tetsuro Sato; 佐藤 哲朗; 長嶋 憲幸


Archive | 2002

Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer

Tetsuro Sato; Noriyuki Nagashima


Archive | 1999

Foamable acrylic resin coating composition

Noriyuki Nagashima; Kinji Nishikawa; Tsutomu Ochi; Yutaka Ohashi; 豊 大橋; 錦二 西川; 勉 越智; 憲幸 長嶋


Archive | 2007

Copper foil with filler particle-containing resin layer and copper-clad laminate using filler particle-containing resin layer

Noriyuki Nagashima; Kensuke Nakamura; 健介 中村; 憲幸 長嶋


Archive | 2007

Copper foil with resin layer containing filler particle and copper-clad laminated plate using the same

Noriyuki Nagashima; Kensuke Nakamura; 健介 中村; 憲幸 長嶋


Archive | 2003

Resin layer-coated copper foil and multilayer printed wiring board obtained with the resin layered-coated copper foil

Tetsuro Sato; Noriyuki Nagashima


Archive | 2006

Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer

Tetsuro Sato; Noriyuki Nagashima


Archive | 2014

POLYIMIDE RESIN COMPOSITION AND THERMAL CONDUCTIVE ADHESIVE FILM USING THE SAME

健二 関根; Kenji Sekine; 長嶋 憲幸; Noriyuki Nagashima; 憲幸 長嶋; 和紀 石川; Kazunori Ishikawa

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