Norman L. Tam

Ultra Low Temperature NiSi Processing

Manuscript not released forpublication due to legal issues.

RTP uniformity improvement through simulation

Some RTP chamber non-uniformity is due to the lamp arrangement geometry. An internally written simulation program was written to reproduce this non-uniformity. The results of the simulation were successfully tested against experimental results. The simulation then lead to finding lamp types and lamp combination recipes which decrease overall non-uniformity in the RTP chamber by 40%

Integrating world-class radiance RTP technology onto a low cost of ownership production-worthy platform

The Radiance Vantage 300 product offers the production-proven performance of the Radiance 300 mm RTP chamber at a reduced cost of ownership. Tool architecture was developed with the goals of system simplification, shipment improvement, and startup time reduction. These goals were accomplished through designs that preserve the final test tool configuration and a new pre-facilitization concept that allows fab preparation to be completed in parallel with tool manufacture. Reduced system footprint combined with high throughput results in effective fab utilization. Ambient control comparable to that of a cluster tool has been verified through oxygen-sensitive process results. Marathon results for cobalt silicide formation, spike anneal, and emissivity independence are presented and demonstrate the readiness of the newest Applied Materials RTP platform for semiconductor production environments.