Oliver Schilling
Infineon Technologies
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Publication
Featured researches published by Oliver Schilling.
Microelectronics Reliability | 2012
Oliver Schilling; M. Schäfer; K. Mainka; M. Thoben; F. Sauerland
Abstract Aging of Al wire bonds of IGBT modules is studied in power cycling tests and FEM simulations. For a clearer distinction of bond wire fatigue from solder delamination a die attach with high melting temperature is chosen to reduce the influence of chip solder aging. Test conditions cover a broad range of cycle amplitude Δ T j . The FEM model for bond wire fatigue achieves a good reproduction of the measured dependence of cycle numbers on Δ T j . A low impact of absolute temperature on N cyc is confirmed both by experiment and theory.
Microelectronics Reliability | 2016
Oliver Schilling; K. Leitner; K.-D. Schulze; Frank Umbach
This work is motivated by the growing importance of lifetime modelling in power electronics. Strongly accelerated High Temperature Reverse Bias (HTRB) testing of power diodes at different stress conditions is performed until alterations and fatigue mechanisms become evident. Two categories of effects can be separated: Drifting breakdown voltage and hard failures with complete loss of blocking capability. Nevertheless the overall stress duration needed to provoke destructive failures is very high with test durations > 2500 h even at almost 230 °C and 100% rated voltage. For both mechanisms the temperature and voltage acceleration is evaluated. Especially temperature acceleration is significant in the regime of testing between 200 °C and 230 °C and an activation energy Ea in the regime > 1 eV can be deduced which is higher compared to values commonly reported in the literature. Failure analysis shows that both package and also chip related effects could contribute to the observed hard failures in HTRB stress under extreme conditions.
Microelectronics Reliability | 2017
S. Kremp; Oliver Schilling
Abstract During the last years applications for power modules with harsh environmental conditions have gained increasing importance. Extreme combinations of environmental conditions especially at weak load conditions have to be understood to avoid risks induced by humidity condensation. The present work investigates the influence of different cycling profiles on condensation phenomena. The phase within the cycling profile that is liable for condensation can be identified and the risk for long term build-up of humidity inside a package is studied in outdoor measurements.
european conference on power electronics and applications | 2011
Krzysztof Mainka; M. Thoben; Oliver Schilling
Archive | 2008
Richard Böttcher; Christian Dr. Robohm; Oliver Schilling
Archive | 2006
Oliver Schilling; Martin Woelz
Archive | 2000
Oliver Schilling; Helmut Seidelmann; Detlef Scholz; Josef Bauer; Alfred Porst; Max Beuermann; Reiner Barthelmess
Archive | 2008
Richard Boettcher; Christian Dr. Robohm; Oliver Schilling
Archive | 2007
Oliver Schilling; Frank Pfirsch
Archive | 2003
Oliver Schilling; Franz Dr. Auerbach; Reinhold Spanke; Christof Klos; Dirk Froebus