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Reinhold Spanke

Infineon Technologies

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Publication

Featured researches published by Reinhold Spanke.

Archive | 2003

Screening of electronic components from laser emissions during the welding of other components onto a circuit board

Oliver Schilling; Franz Dr. Auerbach; Reinhold Spanke; Christof Klos; Dirk Froebus

Archive | 2007

Semiconductor module with current connection element

Reinhold Bayerer; Guido Strotmann; Dirk Froebus; Reinhold Spanke

Archive | 2005

Power semiconductor module, has substrate pre-resistance integrated in supply line extending via conductive track and current supply point to substrate

Christof Klos; Reinhold Spanke; Oliver Schilling

Archive | 2015

Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls

Torsten Gröning; Reinhold Spanke; Dirk Froebus; Thomas Hunger

Archive | 2007

Power semiconductor module having a thermally conductive base plate on which at least four substrates are arranged in at least one single row

Thomas Nuebel; Oliver Schilling; Reinhold Spanke

Archive | 2006

METHOD FOR REDUCING VARIATIONS IN THE BENDING OF ROLLED BASE PLATES AND SEMICONDUCTOR MODULE HAVING SUCH A BASE PLATE SENSOR

Georg Borghoff; Thomas Nuebel; Reinhold Spanke; Martin Woelz

Archive | 2006

Halbleitermodul Semiconductor module

Bayerer Reinhold; Dirk Fröbus; Reinhold Spanke; Guido Strotmann

Archive | 2005

Method for reducing scattering in the sagging of rolled metal base plates for semi conductor modules involves rolling base plates in preferential such as longitudinal direction

Georg Borghoff; Thomas Nübel; Reinhold Spanke; Martin Wölz

Archive | 2005

Verfahren zur Minderung von Streuungen in der Durchbiegung von gewalzten Bodenplatten und Leistungshalbleitermodul mit einer nach diesem Verfahren hergestellten Bodenplatte A method for reducing variations in the deflection of the rolled plates, and bottom power semiconductor module with a base plate prepared by this method

Georg Borghoff; Thomas Nübel; Reinhold Spanke; Martin Wölz

Archive | 2005

Verfahren zur Minderung von Streuungen in der Durchbiegung von gewalzten Bodenplatten und Halbleitermodul mit einer solchen Bodenplatte

Georg Borghoff; Thomas Nübel; Reinhold Spanke; Martin Wölz

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Georg Borghoff

Infineon Technologies

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Oliver Schilling

Infineon Technologies

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Dirk Froebus

Infineon Technologies

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Martin Wölz

Infineon Technologies

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Thomas Nübel

Infineon Technologies

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Guido Strotmann

Infineon Technologies

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Thomas Nuebel

Infineon Technologies

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Martin Woelz

Infineon Technologies

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Reinhold Bayerer

Infineon Technologies

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Thomas Hunger

Infineon Technologies

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