P.P. Rutkevych
Nanyang Technological University
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Publication
Featured researches published by P.P. Rutkevych.
Journal of Applied Physics | 2004
I. B. Denysenko; S. Xu; J.D. Long; P.P. Rutkevych; N. A. Azarenkov; Kontyantyn Ostrikov
The study of inductively coupled Ar/CH 4/H 2 plasmas in the plasma enhanced chemical vapor deposition (PECVD) of self-assembled carbon nanostructures (CN) was presented. A spatially averaged (global) discharge model was developed to study the densities and fluxes of the radical neutrals and charged species, the effective electron temperature, and methane conversion factors under various conditions. It was found that the deposited cation fluxes in the PECVD of CNs generally exceed those of the radical neutrals. The agreement with the optical emission spectroscopy (OES) and quadrupole mass spectrometry (QMS) was also derived through numerical results.
IEEE Transactions on Plasma Science | 2005
J.D. Long; S. Xu; S.Y. Huang; P.P. Rutkevych; M. Xu; C.H. Diong
A low-frequency inductively coupled plasma source has been employed for in situ catalyzed growth of carbon nanostructures. The catalyzing process depends strongly on the plasma parameters and controls the shape and alignment of nanostructures.
Physica Scripta | 2004
P.P. Rutkevych; K. Ostrikov; I. Denysenko; R. Storer; S. Xu
The results of 1D simulation of nanoparticle dynamics in the areas adjacent to nanostructured carbon-based films exposed to chemically active complex plasma of CH4 + H2 + Ar gas mixtures are presented. The nanoparticle-loaded near-substrate (including sheath and presheath) areas of a low-frequency (0.5 MHz) inductively coupled plasma facility for the PECVD growth of the ordered carbon-based nanotip structures are considered. The conditions allowing one to predict the size of particles that can pass through the plasma sheath and softly land onto the surface are formulated. The possibility of soft nano-cluster deposition without any additional acceleration common for some existing nano-cluster deposition schemes is demonstrated. The effect of the substrate heating power and the average atomic mass of neutral species is studied numerically and verified experimentally.
Device and Process Technologies for Microelectronics, MEMS, and Photonics IV | 2005
P.P. Rutkevych; K. Ostrikov; Shuyan Xu
Nanoparticle manipulation by various plasma forces in near-substrate areas of the Integrated Plasma-Aided Nanofabrication Facility (IPANF) is investigated. In the IPANF, high-density plasmas of low-temperature rf glow discharges are sustained. The model near-substrate area includes a variable-length pre-sheath, where a negatively charged nanoparticle is accelerated, and a self-consistent collisionless sheath with a repulsive electrostatic potential. Conditions enabling the nanoparticle to overcome the repulsive barrier and deposit onto the substrate are investigated numerically and experimentally. Under certain conditions the momentum gained by the nanoparticle in the pre-sheath area appears to be sufficient for the driving ion drag force to outbalance the repulsive electrostatic and thermophoretic forces. Numerical results are applied for the explanation of size-selective nanoparticle deposition in the Ar+H2+CH4 plasma-assisted chemical vapor deposition of various carbon nanostructure patterns for electron field emitters and are cross-referenced by the field emission scanning electron microscopy. It is shown that the nanoparticles can be efficiently manipulated by the temperature gradient-controlled thermophoretic force. Experimentally, the temperature gradients in the near-substrate areas are measured in situ by means of the temperature gradient probe and related to the nanofilm fabrication conditions. The results are relevant to plasma-assisted synthesis of numerous nanofilms employing structural incorporation of the plasma-grown nanoparticles, including but not limited to nanofabrication of ordered single-crystalline carbon nanotip arrays for electron field emission applications.
Contributions To Plasma Physics | 2005
K. Ostrikov; Z. L. Tsakadze; P.P. Rutkevych; Jidong Long; S. Xu; I. Denysenko
Computational Materials Science | 2004
I. B. Denysenko; K. Ostrikov; P.P. Rutkevych; S. Xu
Science & Engineering Faculty | 2008
Y.P. Ren; S. Xu; J.D. Long; P.P. Rutkevych; Q.J. Cheng; S.Y. Huang; K. Ostrikov
Science & Engineering Faculty | 2008
Q.J. Cheng; S. Xu; J.W. Chai; S.Y. Huang; Y.P. Ren; J.D. Long; P.P. Rutkevych; K. Ostrikov
Science & Engineering Faculty | 2007
P.P. Rutkevych; K. Ostrikov; S. Xu
international conference on plasma science | 2006
P.P. Rutkevych; K. Ostrikov; Shuyan Xu