P. Vettiger

Fabrication process of high aspect ratio elastic structures for piezoelectric motor applications

Briefly reports on advances in the fabrication technology of components for millimeter size ultrasonic piezoelectric motors. A very large height to width aspect ratio with good lateral patterning resolution is required for the active component in acoustic mode conversion. A new fabrication process using a thick epoxy-based material (SU-8) and the electroplating of nickel is demonstrated. The main advantages over past fabrication methods are better flexibility in the design, simplicity of the fabrication process and the combination of metallic materials (Ni) with polymeric materials (SU-8). The mechanical properties of SU-8 have been measured using free cantilever beam structures.

Advanced temperature compensation for piezoresistive sensors based on crystallographic orientation

We describe a highly effective method of reducing thermal sensitivity in piezoresistive sensors, in particular silicon cantilevers, by taking advantage of the dependence of the piezoresistive coefficient of silicon on crystallographic orientation. Two similar strain-sensing elements are used, positioned at 45 degrees to each other: One is set along a crystalline axis associated with a maximum piezoresistive coefficient to produce the displacement signal, while the other is set along an axis of the vanishing coefficient to produce the reference signal. Unlike other approaches, both sensing elements are coupled to the same cantilever body, maximizing thermal equilibration. Measurements show at least one order of magnitude improvement in thermal disturbance rejection over conventional approaches using uncoupled resistors.

All-photoplastic, soft cantilever cassette probe for scanning force microscopy

Multiple single-lever probes for scanning force microscopy arranged in a cassette design and made of a low-stiffness photoplastic material have been developed and successfully tested by imaging DNA molecules. The new concept consists of a column of a one-dimensional array of cantilevers with integrated tips, the first of which is used for imaging and the others are spares in case the first one becomes degraded. When this happens, the lever is mechanically removed from the chip so that the next spare becomes ready for scanning. The probes are fabricated of a photoplastic material, which allows simple batch fabrication and facilitates realization of specific mechanical properties for cantilevers—such as low stiffness—that are very difficult to achieve with classical silicon technology. The batch fabrication process, based on spin coating and subsequent near-ultraviolet exposure and development steps of the photoplastic SU-8, results in well-controlled and uniform mechanical properties of the probes within t...

High-yield wafer chuck for single-sided wet etching of MEMS structures

We describe a new O-ring setup for wet etching processes. The low-cost approach using siloxane-based sealing rings has been successful for the single-sided etching of silicon and silicon dioxide using a reduced volume of KOH and BHF, respectively. With this approach, the previously fabricated device elements on the reverse wafer side are not damaged. The etchant was heated by an infrared lamp. The achieved etch control allowed the fabrication of membranes only 5 /spl mu/m thick with good accuracy using an etch stop layer.