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Paolo Crema

STMicroelectronics

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Publication

Featured researches published by Paolo Crema.

Archive | 1999

Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices

Paolo Crema; Carlo Passagrilli

Archive | 2000

METHOD FOR REMOVING MOLDING RESIDUES IN THE FABRICATION OF PLASTIC PACKAGES FOR SEMICONDUCTOR DEVICES

Paolo Crema; Roberto Tiziani; Markus Guggenmos

Archive | 1995

Method and apparatus for electrically insulating heat sinks in electronic power devices

Paolo Crema

Archive | 1999

Power semiconductor device for "flip-chip" connections

Roberto Tiziani; Paolo Crema; Marco Mantovani

Archive | 2014

Cover piece for packaging of electronic equipment, packaged micro-electromechanical equipment, and electronic system

Alex Gritti; Paolo Crema

Archive | 2013

PROCESS FOR MANUFACTURING A LID FOR AN ELECTRONIC DEVICE PACKAGE, AND LID FOR AN ELECTRONIC DEVICE PACKAGE

Alex Gritti; Paolo Crema

Archive | 2013

METHOD AND APPARATUS FOR MANUFACTURING LEAD FRAMES

Paolo Crema

Archive | 2016

ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS

Laura Ceriati; Paolo Crema; Agatino Minotti

Archive | 2016

Semiconductor device and packaging body

Lucio Ceriani; Paolo Crema; Agatino Minotti

european microelectronics and packaging conference | 2009

The necessity of corrosion protection for solderable pure tin deposits on IC outer leads

Jürgen Barthelmes; Paolo Crema; Peter Kühlkamp; Olaf Kurtz

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Collaboration

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Roberto Tiziani

STMicroelectronics

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Agatino Minotti

STMicroelectronics

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Alex Gritti

STMicroelectronics

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Marco Mantovani

STMicroelectronics

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Markus Guggenmos

STMicroelectronics

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Carlo Passagrilli

STMicroelectronics

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Laura Ceriati

STMicroelectronics

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Jürgen Barthelmes

Atotech

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Olaf Kurtz

Atotech

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Peter Kühlkamp

Atotech

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