Agatino Minotti

Vertical conduction power electronic device package and corresponding assembling method

Intelligent Power Module and related assembling method

DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE

PROCESS AND SYSTEM FOR MANUFACTURING AN ENCAPSULATED SEMICONDUCTOR DEVICE

Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device

Semiconductor element with semiconductor die and lead frames

Stacked multi-die electronic device with interposed electrically conductive strap

SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND MANUFACTURING PROCESS THEREOF

THERMOELECTRIC ENERGY HARVESTING DEVICE AND METHOD OF HARVESTING ENVIRONMENTAL ENERGY

ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS