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Featured researches published by Paul T. Lin.


Proceedings., 39th Electronic Components Conference | 1989

Molded carrier rings for fine pitch surface mount packages

J. Hamilton; Michael B. McShane; Charles G. Bigler; James J. Casto; Paul T. Lin

A molded carrier ring concept intended to reduce the incidence of bent leads and coplanarity rejects while providing increased output-to-mix potential and easy standardization for customers and equipment manufacturers is presented. The methodologies used to design a family of molded carrier rings around various quad-flat-pack and plastic quad-flat-pack package types are described. The algorithms and assumptions used to optimize the ring size and shape are discussed. Test contact design and performance, electrical characteristics, and thermal/mechanical modeling are also discussed.<<ETX>>


38th Electronics Components Conference 1988., Proceedings. | 1988

Low profile plastic quad flat package: LPPQFP

Michael B. McShane; James J. Casto; J. Bigler; Paul T. Lin

The effects of stress on the mechanical integrity of the high pin-count surface-mount PQFP packages and on very large (500 mil) IC dies have been studied experimentally. Passivation cracks, metal movement, and crack propagation in the package are examined. Changes in package design that improve the resistance to thermal excursions of surface-mounted devices are described. A factorial experiment is reviewed that used package thickness, lead-frame materials, and adhesion promoters as the variables. The latest ultra-low-stress molding compounds and passivations were studied. The affect of adding stress buffers to mold compounds, particularly crack passivation, is emphasized. Also included are experimental data using a package-development test die to electrically characterize the effects of the various package design and material changes as well as the system performance during various stress tests such as temperature cycle, thermal shock, moisture preconditioning/crack resistance and moisture resistance.<<ETX>>


Archive | 1992

Semiconductor device having a pad array carrier package

Paul T. Lin; Michael B. McShane; Howard P. Wilson


Archive | 1992

Three-dimensional multi-chip pad array carrier

Paul T. Lin


Archive | 1991

Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film

Paul T. Lin; Michael B. McShane; Sugio Uchida; Takehi Sato


Archive | 1992

Overmolded semiconductor device having solder ball and edge lead connective structure

Paul T. Lin; Michael B. McShane


Archive | 1991

Semiconductor device having dual electrical contact sites

Michael B. McShane; Paul T. Lin


Archive | 1992

Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

Paul T. Lin; Michael B. McShane


Archive | 1993

Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery

Paul T. Lin


Archive | 1994

Shielded liquid encapsulated semiconductor device and method for making the same

Paul T. Lin

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