Pedro A. Chalco
IBM
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Publication
Featured researches published by Pedro A. Chalco.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1995
B. W. Hussey; G. Arjavalingam; Arunava Gupta; Pedro A. Chalco; H. Tong
The use of the thermoelectric voltage generated between the tip and the wire during laser wirebonding is described as a process monitor. The change in thermoelectric response during melting of the wire is detected and used to control the laser pulselength. Thus, optimum bonding is achieved independent of thermal environment at different pad locations. The use of the process monitor for bonding on gold pads on multilayer alumina substrates is described in detail. >
Archive | 1996
Michael John Brady; Pedro A. Chalco; Francois Guindon; Paul Andrew Moskowitz; Philip Murphy
Archive | 1990
Pedro A. Chalco
Archive | 1992
Pedro A. Chalco; Wesley LeRoy Hillman; Richard H. Kurth; Nicholas T. Panousis
Archive | 1995
John Richard Behun; Pedro A. Chalco; Joseph Funari; J. Robert Young
Archive | 1990
Pedro A. Chalco; Carlos Juan Sambucetti
Archive | 1996
Paul Matthew Alt; Pedro A. Chalco; Bruce K. Furman; Raymond Robert Horton; Chandrasekhar Narayan; Benal Lee Owens; Kevin W. Warren; Steven L. Wright
Archive | 1988
Pedro A. Chalco; Josef Charles Andreshak
Archive | 1997
Pedro A. Chalco; Raymond Robert Horton; Chandrasekhar Narayan; Michael Jon Palmer
Archive | 1993
Pedro A. Chalco; Matthew F. Cali; Laertis Economikos; James L. Speidell
