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Dive into the research topics where Peter Gerard Ledermann is active.

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Featured researches published by Peter Gerard Ledermann.


Lasers in Microelectronic Manufacturing | 1991

Laser-formed structures to facilitate TAB bonding

Peter Gerard Ledermann; Glen Walden Johnson; Mark B. Ritter

A laser heating process was used to form structures which facilitate tape automated bonding (TAB). Uniform metal spheroids were created by melting the end of each TAB conductor intended for connection to the terminal pads of an integrated circuit (IC). A fully automated laser tool designed and built to fabricate these structures is described. Results for ICs bonded using this technology are presented.


Archive | 1990

Tamper resistant packaging for information protection in electronic circuitry

Liam David Comerford; Peter Gerard Ledermann; Lawrence Irwin Levy; Steve R. White


Archive | 1988

Integrated circuit package with improved cooling means

Brian D. Arldt; Peter H. Bruhn; M. Lawrence Buller; Peter Gerard Ledermann; Stephen Dale Linam; Barbara J Mcnelis; Lawrence S. Mok; Paul Andrew Moskowitz


Archive | 1992

Packages for stacked integrated circuit chip cubes

Thomas Mario Cipolla; Paul W. Coteus; Ioannis Damianakis; Glen Walden Johnson; Peter Gerard Ledermann; Linda C. Matthew; Lawrence S. Mok


Archive | 1988

Multilevel integrated circuit packaging structures

Harry Randall Bickford; Mark Fielding Bregman; Thomas Mario Cipolla; John Gow; Peter Gerard Ledermann; Ekkehard F. Miersch; Leonard T. Olson; David P. Pagnani; Timothy Clark Reiley; Uh-Po Eric Tsou; Walter Valerian Vilkelis


Archive | 1989

Solder deposition system

Peter Gerard Ledermann; Luu Thanh Nguyen


Archive | 1986

Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape

Rodney T. Hodgson; Harry Jordan Jones; Peter Gerard Ledermann; Timothy Clark Reiley; Paul Andrew Moskowitz


Archive | 1990

INTEGRATED CIRCUIT TESTING SYSTEM HAVING A CANTILEVERED CONTACT LEAD PROBE PATTERN MOUNTED ON A FLEXIBLE TAPE FOR INTERCONNECTING AN INTEGRATED CIRCUIT TO A TESTER

Mark Fielding Bregman; Paul R. Hoffman; Peter Gerard Ledermann; Paul Andrew Moskowitz; Roger A. Pollak; Timothy Clark Reiley; Mark B. Ritter


Archive | 1988

Dam for lead encapsulation

Caroline Ann Kovac; Peter Gerard Ledermann; Luu T. Nguyen


Archive | 1990

Solder placement nozzle with inert cover gas and inert gas bleed

Terry F. Hayden; Christopher A. Hicks; Peter Gerard Ledermann; Alvin D. Nguyne; Stephen C. Steinbach; Stanley K. Yu

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