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Mark Fielding Bregman

IBM

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Publication

Featured researches published by Mark Fielding Bregman.

Archive | 1999

Systems, methods and computer program products for providing time and location specific advertising via the internet

Daniel Quinto Bandera; Mark Fielding Bregman; Ajei Sarat Gopal; Sandeep K. Singhal

Archive | 1990

Electro-optical connectors

Mark Fielding Bregman; W. D. Brewer; Mitchell S. Cohen; Glen Walden Johnson; I. C. Noyan; Modest M. Oprysko; Mark B. Ritter; Dennis L. Rogers; Jeannine M. Trewhella

Archive | 1988

Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween

Harry Randall Bickford; Mark Fielding Bregman; Paul Andrew Moskowitz; Michael J. Palmer; Timothy Clark Reiley; Paige Adams Poore; Caroline Ann Kovac

Archive | 1988

Multilevel integrated circuit packaging structures

Harry Randall Bickford; Mark Fielding Bregman; Thomas Mario Cipolla; John Gow; Peter Gerard Ledermann; Ekkehard F. Miersch; Leonard T. Olson; David P. Pagnani; Timothy Clark Reiley; Uh-Po Eric Tsou; Walter Valerian Vilkelis

Archive | 1990

Multi-level circuit card structure

Mark Fielding Bregman; Stephen L. Buchwalter; Karl Hermann; Caroline Ann Kovac; Paige Adams Poore; Alfred Viehbeck

Archive | 1990

INTEGRATED CIRCUIT TESTING SYSTEM HAVING A CANTILEVERED CONTACT LEAD PROBE PATTERN MOUNTED ON A FLEXIBLE TAPE FOR INTERCONNECTING AN INTEGRATED CIRCUIT TO A TESTER

Mark Fielding Bregman; Paul R. Hoffman; Peter Gerard Ledermann; Paul Andrew Moskowitz; Roger A. Pollak; Timothy Clark Reiley; Mark B. Ritter

Archive | 1991

Optical bus for computer systems

Mark Fielding Bregman; I. C. Noyan; Mark B. Ritter; Harold S. Stone

Archive | 1990

Electronic substrate multiple location conductor attachment technology

Mark Fielding Bregman; Raymond Robert Horton; Alphonso P. Lanzetta; I. C. Noyan; Michael J. Palmer; Ho-Ming Tong

Archive | 1989

Three dimensional microelectric packaging

Mark Fielding Bregman; Raymond Robert Horton; I. C. Noyan; Michael J. Palmer

Archive | 1992

Method for bonding dielectric mounted conductors to semiconductor chip contact pads

Mark Fielding Bregman; Raymond Robert Horton; Alphonso P. Lanzetta; I. C. Noyan; Michael J. Palmer; Ho-Ming Tong

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Collaboration

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I. C. Noyan

IBM

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Timothy Clark Reiley

IBM

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Mark B. Ritter

IBM

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Paul Andrew Moskowitz

IBM

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Caroline Ann Kovac

IBM

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Harry Randall Bickford

IBM

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Michael Jon Palmer

IBM

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Paige Adams Poore

IBM

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Peter Gerard Ledermann

IBM

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Raymond Robert Horton

IBM

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