Peter Kindersley

Applied Quantum X Implant System: Technology Enhancements to Enable Production‐Worthy Performance at the 45 nm Node

Mechanical scanning of the wafer in 2 dimensions is one approach that has been used to achieve single wafer processing for high current ion implantation. This approach simplifies the beamline design, compared to scanned beam or ribbon beam architectures, but has required a number of new technologies and methods in the scanner hardware and in dosimetry control. The Applied® Quantum X Implant system was designed to incorporate these new technologies, and has achieved the process performance and low energy productivity required for advanced junction formation at the 65 nm technology node. Since its introduction, extensive qualification and development work has been carried out, to extend its capability to the next technology generation. A number of further innovations and improvements to the beamline and platform have been developed, extending its throughput and process control capability to be production‐worthy at 45 nm.This paper will review the process control challenges associated with the 2d mechanical ...