Peter Stauss

Role of low-temperature AlGaN interlayers in thick GaN on silicon by metalorganic vapor phase epitaxy

Thin AlGaN interlayers have been grown into a thick GaN stack on Si substrates to compensate tensile thermal stress and significantly improve the structural perfection of the GaN. In particular, thicker interlayers reduce the density in a-type dislocations as concluded from x-ray diffraction (XRD) measurements. Beyond an interlayer thickness of 28 nm plastic substrate deformation occurs. For a thick GaN stack, the first two interlayers serve as strain engineering layers to obtain a crack-free GaN structure, while a third strongly reduces the XRD ω-(0002)-FWHM. The vertical strain and quality profile determined by several XRD methods demonstrates the individual impact of each interlayer.

Internal quantum efficiency of high-brightness AlGaInP light-emitting devices

The internal quantum efficiency of (AlxGa1−x)0.5In0.5P light-emitting devices (LEDs), with an emission wavelength ranging from 650 to 560 nm, is determined by means of a model that takes into account the radiative and nonradiative recombination in the active layer, the diffusive leakage of carriers into the confining layers, and the influence of photon recycling on the light extraction efficiency. The evaluation is based on measurements of the external quantum efficiency of the LEDs as a function of the operating current and temperature. The analysis provides the wavelength dependence of both the nonradiative recombination as well as the carrier leakage.

High-Brightness AlGaInP Light-Emitting Diodes Using Surface Texturing

There is a large number of new applications in lighting and display technology where high-brightness AlGaInP-LEDs can provide cost-efficient solutions for the red to yellow color range. Osram Opto Semiconductors has developed a new generation of MOVPE-grown AlInGaP-LEDs to meet these demands. Our structures use optimized epitaxial layer design, improved contact geometry and a new type of surface texturing. Based on this technology we achieve luminous efficiencies of more than 30 lm/W and wallplug efficiencies exceeding 10% of LEDs on absorbing GaAs substrates. The epitaxial structure does not require the growth of extremely thick window layer and standard processes are used for the chip fabrication. This allows for high production yields and cost-efficient production.

Recent progress of AlGaInP thin-film light-emitting diodes

The concept of an AlGaInP thin-film light emitting diode includes a structure of semiconductor layers with low optical absorption on which a highly reflective mirror is applied. After bonding this wafer to a suitable carrier, the absorbing GaAs substrate is removed. Subsequently, electrical contacts and an efficient light scattering mechanism for rays propagating within the chip is provided. To achieve high efficiency operation it is crucial to optimize all functional parts of the device, such as the mirror, contacts, and active layer. Different mirrors consisting of combinations of dielectrics and metals have been tested. New chip designs have been evaluated to reduce the absorption at the ohmic contacts of the device. For efficient light scattering, the surface roughness of the at the emission window has to be optimized. Using these structures, and a thin active layer consisting of five compressively strained quantum wells, an external quantum efficiency of 40% is demonstrated at 650 nm. Further improvement is expected. Since the AlGaInP material system can provide only poor carrier confinement for active layers emitting in the yellow wavelength regime, the internal efficiency of these LEDs is comparably low. In order to reduce the problem of carrier leakage, a yellow active region usually consists of some hundred nanometers of active material. To circumvent the problem of this highly absorbing active layer, a separation of the light generation and the area of light extraction is suggested for yellow thin-film LEDs. First results are presented in this paper.

Scalability of buried microreflector light-emitting diodes for high-current applications

The combination of wafer soldering using metal layers and the introduction of buried micro-reflector structures has proven to be a promising approach to fabricate high brightness, substrate-less LEDs in the AlGaInP material system. In addition to the enhanced light output, the scalability of this approach has been predicted as a major advantage. In contrast to other approaches, larger area LEDs can be fabricated without altering the epitaxial structure and thickness of layers simply by offering a larger area for light generation. First samples of amber (λ = 615 nm) buried micro-reflector LEDs with side-length up to 1000 μm have been realized. Devices mounted in packages with improved heat sinks are capable of low voltage CW operation with currents as high as 600 mA (Vfw≤ 2,8 V) without significant thermal flattening of the light-current characteristics. The maximum luminous flux achieved at these oeprating conditions is 46 lumen. Already these first experiments demonstrate the potential of the concept of buried micro-reflector LEDs not only for high-brightness but also for high-current operation. The results are among the best values of high-flux LEDs in this wavelength range.

Efficient light-emitting diodes with radial outcoupling taper at 980- and 630-nm emission wavelength

We have investigated efficient light outcoupling from light- emitting diodes (LEDs) by introducing lateral tapers. The concept is based on light generation in the very central area of a circularly symmetric structure. After propagating between two highly reflecting mirrors light is outcoupled in a tapered mesa region. By proper processing we achieve quantum efficiencies of almost 40% for outcoupling via a planar surface or quantum and wallplug efficiencies of 52% and 48%, respectively, for encapsulated devices. Neglecting reabsorption, approximative equations yield optimum design parameters.

InGaAlP thin film LEDs with high luminous efficiency

In Thinfilm LEDs, the substrate absorption of the generated light is avoided by a metal reflector between the light emitting layer and the substrate. The light extraction can be further enhanced by buried microreflectors or surface texturing. We demonstrate that the combination of these technologies gives prospects equal or superior to all other known approaches in terms of luminous efficiency and luminance. At a peak wavelength of 617 nm, we have obtained a luminous efficiency of 95.7 lm/W at 20 mA. We further analyze the internal and light extration efficiencies of our LEDs using raytracing simulations as well as a theoretical model for the internal efficiency. This analysis shows quantitatively that the efficient light extraction from InGaAlP thinfilm LEDs becomes more and more difficult when approaching shorter wavelengths.

Color-dependent degradation of high-brightness AlGaInP LEDs

Operation-induced degradation of internal quantum efficiency of high-brightness (AlxGa1-x)0.5In0.5P light-emitting devices (LEDs) is analysed experimentally and theoretically. A test series of LEDs was grown by MOCVD with identical layer sequence but different Aluminum content x in the active AlGaInP layer resulting in devices emitting light between 644 nm and 560 nm. The analysis yields the wavelength dependence of both the nonradiative recombination constant A as well as the carrier leakage parameter C of devices before and after aging. While test devices with λ>615 nm are very stable, LEDs with shorter emission wavelengths exhibit both an increase of A and a slight decrease of C upon aging. Possible degradation mechanisms are discussed.

Efficiency and reliability of AlInGaP LEDs grown on germanium substrates

The use of Germanium as an alternative substrate for the growth of AlInGaP LEDs provides several technical advantages such as lower substrate costs and the possibility of fabricating As-free AlInGaP devices. The LED layer structures are grown in a multiwafer MOVPE reactor on 4 inch Ge substrates. The growth conditions, such as temperature and substrate orientation, influence the LED external efficiency and its degradation behavior. In particular, it is found that during growth Ge is incorporated into the layers, which strongly affects the LED efficiency. Moreover a defect annealing occurs during regular operation resulting in an increased efficiency. Electrical characterization as well as deep level transient spectroscopy are performed in order to characterize the nonradiative recombination centers. In addition a quantitative analysis of the external quantum efficiency, before and after degradation, is carried out and the relative change in the nonradiative recombination rate is evaluated.

A predictive model for plastic relaxation in (0001)-oriented wurtzite thin films and heterostructures

In this work, we present an experimental and theoretical study of the process of plastic strain relaxation of (0001)-oriented wurtzite heterostructures. By means of transmission electron microscopy and atomic force microscopy, we show that plastic relaxation of tensile strained AlxGa1-xN/GaN heterostructures proceeds predominantly by nucleation of a-type misfit dislocations in the 1 3 ⟨ 11 2 ¯ 0 ⟩ | 0001 slip-system driven by a three-dimensional surface morphology, either due to island growth or due to cracking of the layer. Based on our experimental results, we derive a quantitative model for the dislocation nucleation process. With the shear stress gradients at the nucleation sites of a-type misfit dislocations obtained by the finite element method, we calculate the critical thickness for plastic relaxation of strained wurtzite films and heterostructures as dependent on the surface morphology. The crucial role of the growth mode of the film on the strain relaxation process and the resulting consequences is discussed in the paper.In this work, we present an experimental and theoretical study of the process of plastic strain relaxation of (0001)-oriented wurtzite heterostructures. By means of transmission electron microscopy and atomic force microscopy, we show that plastic relaxation of tensile strained AlxGa1-xN/GaN heterostructures proceeds predominantly by nucleation of a-type misfit dislocations in the 1 3 ⟨ 11 2 ¯ 0 ⟩ | 0001 slip-system driven by a three-dimensional surface morphology, either due to island growth or due to cracking of the layer. Based on our experimental results, we derive a quantitative model for the dislocation nucleation process. With the shear stress gradients at the nucleation sites of a-type misfit dislocations obtained by the finite element method, we calculate the critical thickness for plastic relaxation of strained wurtzite films and heterostructures as dependent on the surface morphology. The crucial role of the growth mode of the film on the strain relaxation process and the resulting ...