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Dive into the research topics where Philip H. Bowles is active.

Publication


Featured researches published by Philip H. Bowles.


Archive | 2007

Stacked and shielded die packages with interconnects

Philip H. Bowles; Li Li; Lianjun Liu


Archive | 2006

Methods and apparatus for RF shielding in vertically-integrated semiconductor devices

Lianjun Liu; Philip H. Bowles; Li Li


Archive | 2006

Microelectronic assembly with back side metallization and method for forming the same

Darrell G. Hill; Philip H. Bowles; Jan Campbell; Terry K. Daly; Jason R. Fender; Lakshmi N. Ramanathan; Neil T. Tracht


Archive | 2012

Sensor package and method of forming same

Philip H. Bowles; Paige M. Holm; Stephen R. Hooper; Raymond M. Roop


Archive | 2015

Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

Philip H. Bowles; Stephen R. Hooper


Archive | 2014

SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF DIFFERING SIZES

Philip H. Bowles


Archive | 2012

METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE

William G. McDonald; Alexander M. Arayata; Philip H. Bowles; Stephen R. Hooper


Archive | 2013

Sensor device packages and related fabrication methods

Stephen R. Hooper; Philip H. Bowles


Archive | 2014

CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME

Stephen R. Hooper; Philip H. Bowles


Archive | 2014

SENSOR PACKAGING METHOD AND SENSOR PACKAGES

Philip H. Bowles; Paige M. Holm; Stephen R. Hooper; Raymond M. Roop

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Lianjun Liu

Freescale Semiconductor

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Li Li

Freescale Semiconductor

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Jan Campbell

Freescale Semiconductor

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